High Aspect Ratio Microstructuring of Copper Surfaces by Means of Ultrashort Pulse Laser Ablation

Büttner, H.; Hajri, Melik; Roth, Raoul; Wegener, Konrad

doi:10.1016/j.procir.2017.12.045

Cited by 11 publications

(5 citation statements)

References 11 publications

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“…Table . 1 shows a list of these 9 duty conditions and one CW condition, 10 conditions in total. Table . 1 also shows the pulse width (µsec) calculated from the duty and the aspect ratio calculated from the penetration depth and welded width based on the cross-sectional image [20,21]. Figure 7 shows the relationship between pulse width and aspect ratio for the four typical conditions which are No.…”

Section: Fig7 Relationship Between Aspect Ratio and Pulse Width Along...mentioning

confidence: 99%

High-efficiency processing of copper materials with pulse-driving mode using high-brightness blue laser oscillator

Hishida,

Nakao,

Tsutsumi

et al. 2024

High-Power Diode Laser Technology XXII

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Development of high brightness blue lasers that can process copper materials has been increasingly expected to implement a highly efficient processing and downsizing that help to achieve Green Transformation (GX). In order to meet this expectation, the high brightness blue laser oscillator has been developed. Based on the direct diode laser (DDL) method which uses a semiconductor blue laser as a direct light source and our unique wavelength beam combining (WBC) technology, it has achieved 2.1 (kW) of an output power, 3.2 (mm mrad) of Beam Parameter Product (BPP) indicating the beam quality. This laser oscillator can establish a penetration welding of the copper materials with over 2 (mm) in thickness. Development of the pulse power circuit has helped to produce a high current pulse power supply which provides 10 (kHz) of the frequency, 4.8 (μsec) of the rise time, and 0.8 (μsec) of the fall time. Furthermore, the copper plate welding experiment conducted with the pulse power has demonstrated a 3.5-fold higher precision processing compared to the continuous wave driving processing in terms of the aspect ratio which shows the relationship between the welding width and depth.

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Section: Fig7 Relationship Between Aspect Ratio and Pulse Width Along...mentioning

confidence: 99%

High-efficiency processing of copper materials with pulse-driving mode using high-brightness blue laser oscillator

Hishida,

Nakao,

Tsutsumi

et al. 2024

High-Power Diode Laser Technology XXII

View full text Add to dashboard Cite

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“…Laser ablation processes inducing copper surface modification were reported for pulsed irradiation with different pulse duration and laser wavelength [1, 3, 5, 15, 18, 20-22, 26, 28, 29, 31, 33, 41, 42, 44]. Laser ablation was studied for ns- [3,14,18,23,33,37], ps- [5,13,15,20,22,23,29,41,42,44] and fs-laser irradiation [15,20,26,28,29,41,42,44] with wavelengths from ultraviolet to infrared. The ablation was furthermore investigated as a function of several other laser parameters such as the wavelength λ [33], the pulse duration ∆t p [15,29,41], the number of laser pulses N [5], the laser pulse energy E [33], the repetition rate f [20,28], as well as multi-pulse irradiation (burst) [4,44].…”

Section: Introductionmentioning

confidence: 99%

“…Laser ablation was studied for ns- [3,14,18,23,33,37], ps- [5,13,15,20,22,23,29,41,42,44] and fs-laser irradiation [15,20,26,28,29,41,42,44] with wavelengths from ultraviolet to infrared. The ablation was furthermore investigated as a function of several other laser parameters such as the wavelength λ [33], the pulse duration ∆t p [15,29,41], the number of laser pulses N [5], the laser pulse energy E [33], the repetition rate f [20,28], as well as multi-pulse irradiation (burst) [4,44]. Usually, a complex correlation of the laser processing parameters and the resulting ablation characteristics, such as the ablation volume V ab , the shape of the formed crater, the crater width d and depth ∆z, are observed.…”

Section: Introductionmentioning

confidence: 99%

Secondary electron yield reduction of copper after 355 nm ultrashort pulse laser ablation

Lorenz

Himmerlich

Ehrhardt

et al. 2022

Lasers Manuf. Mater. Process.

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Nanostructured surfaces exhibit remarkable chemical, physical and microbiological properties and have therefore various technical and industrial applications. The ultrashort laser pulse irradiation (wavelength λ = 355 nm, pulse duration Δtp = 12 ps, repetition rate f = 100 kHz) of copper samples with appropriate laser parameters results in the formation of a micro- and nanostructured surfaces. The influence of these hierarchically textured surfaces on the secondary electron yield (SEY) was studied especially with regard to their morphological and geometrical properties. Specific SEY changes are caused by both, the shape and the depth of the microstructures, as well as the morphology of the formed nanostructures; that can be either compact flower head-like nanostructures, non-compact filament-shaped nanostructures, molten and resolidified spherical structures, or minor modified surfaces. The measured SEY as a function of the primary electron energy is correlated with the surface topography that forms upon laser irradiation. The SEY decreases with increasing accumulated laser fluence and ablated volume, respectively. Especially flower-head-like nanostructures can be produced at high laser power (P ≥ 400 mW) and low scanning velocity (v ≤ 10 mm/s) and represent a surface with strongly reduced SEY maximum as low as 0.7.

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“…The laser machining process, especially laser milling, involves various laser parameters. The important parameters reported in literature, for example by Büttner et al [ 29 ], are laser intensity or power, scanning cycle, pulse repartition rate, pulse overlap, scan strategy, laser spot diameter, and number of laser passes to machine a particular feature. Several laser machining processes are in practice including laser drilling, milling, and cutting in which the mentioned laser parameters are needed to be tuned as per machining requirements.…”

Section: Introductionmentioning

confidence: 99%

Achieving the Minimum Roughness of Laser Milled Micro-Impressions on Ti 6Al 4V, Inconel 718, and Duralumin

et al. 2020

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Titanium-aluminium-vanadium (Ti 6Al 4V) alloys, nickel alloys (Inconel 718), and duraluminum alloys (AA 2000 series) are widely used materials in numerous engineering applications wherein machined features are required to having good surface finish. In this research, micro-impressions of 12 µm depth are milled on these materials though laser milling. Response surface methodology based design of experiment is followed resulting in 54 experiments per work material. Five laser parameters are considered naming lamp current intensity (I), pulse frequency (f), scanning speed (V), layer thickness (LT), and track displacement (TD). Process performance is evaluated and compared in terms of surface roughness through several statistical and microscopic analysis. The significance, strength, and direction of each of the five laser parametric effects are deeply investigated for the said alloys. Optimized laser parameters are proposed to achieve minimum surface roughness. For the optimized combination of laser parameters to achieve minimum surface roughness (Ra) in the titanium alloy, the said alloy consists of I = 85%, f = 20 kHz, V = 250 mm/s, TD = 11 µm, and LT = 3 µm. Similarly, optimized parameters for nickel alloy are as follows: I = 85%, f = 20 kHz, V = 256 mm/s, TD = 8 µm, and LT = 1 µm. Minimum roughness (Ra) on the surface of aluminum alloys can be achieved under the following optimized parameters: I = 75%, f = 20 kHz, V = 200 mm/s, TD = 12 µm, and LT = 3 µm. Micro-impressions produced under optimized parameters have surface roughness of 0.56 µm, 2.46 µm, and 0.54 µm on titanium alloy, nickel alloy, and duralumin, respectively. Some engineering applications need to have high surface roughness (e.g., in case of biomedical implants) or some desired level of roughness. Therefore, validated statistical models are presented to estimate the desired level of roughness against any laser parametric settings.

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High Aspect Ratio Microstructuring of Copper Surfaces by Means of Ultrashort Pulse Laser Ablation

Cited by 11 publications

References 11 publications

High-efficiency processing of copper materials with pulse-driving mode using high-brightness blue laser oscillator

High-efficiency processing of copper materials with pulse-driving mode using high-brightness blue laser oscillator

Secondary electron yield reduction of copper after 355 nm ultrashort pulse laser ablation

Achieving the Minimum Roughness of Laser Milled Micro-Impressions on Ti 6Al 4V, Inconel 718, and Duralumin

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