2022
DOI: 10.1088/2634-4386/ac9012
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HfO2-based resistive switching memory devices for neuromorphic computing

Abstract: HfO2-based resistive switching memory (RRAM) combines several outstanding properties, such as high scalability, fast switching speed, low power, compatibility with complementary metal-oxide-semiconductor technology, with possible high-density or three-dimensional integration. Therefore, today, HfO2 RRAMs have attracted a strong interest for applications in neuromorphic engineering, in particular for the development of artificial synapses in neural networks. This review provides an overview of the structure, th… Show more

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Cited by 28 publications
(19 citation statements)
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References 142 publications
(243 reference statements)
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“…It should be noted that HfO 2 possesses a set of key characteristics essential for practical hardware systems, including a high dielectric constant for scalable CMOS circuits and excellent compatibility with CMOS fabrication processes. 37 As shown in Figure S2, the resistive switching phenomena were confirmed in both devices during each forming process. After such processes, the devices were operated as reversible memory devices.…”
Section: Resultsmentioning
confidence: 63%
“…It should be noted that HfO 2 possesses a set of key characteristics essential for practical hardware systems, including a high dielectric constant for scalable CMOS circuits and excellent compatibility with CMOS fabrication processes. 37 As shown in Figure S2, the resistive switching phenomena were confirmed in both devices during each forming process. After such processes, the devices were operated as reversible memory devices.…”
Section: Resultsmentioning
confidence: 63%
“…Finally, Brivio et al review structure, properties and applications of non-volatile as well as volatile HfO 2 -based RRAM devices in neuromorphic computing [5]. In this work, first the defect mediated filamentary switching mechanisms are discussed.…”
Section: Stefan Slesazeck and Thomas Mikolajickmentioning
confidence: 96%
“…[ 13 ] Particularly, representative filament‐type switching is performed using HfO x ‐based RRAM, which has been identified as a promising material for the RRAM switching layer and offers distinct advantages such as wide bandgap and high dielectric constants. [ 14,15 ] However, HfO x ‐based RRAM has inherent issues entailing individual defect diffusion and instability, which causes the fluctuation of switching values during consecutive switching cycles. [ 16–18 ] More precisely, cycle‐to‐cycle and device‐to‐device variations are determined by the filament shapes, location in the insulator, and the internal structure of the RRAM devices.…”
Section: Introductionmentioning
confidence: 99%