Heterophase materials for fused filament fabrication of structural electronics

Podsiadły, Bartłomiej; Skalski, Andrzej; Wałpuski, Bartłomiej; Słoma, Marcin

doi:10.1007/s10854-018-0391-4

Cited by 24 publications

(16 citation statements)

References 58 publications

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“…Our laboratory has extruded filaments with diameter values ranging from 1.7 mm to 1.8 mm, which is acceptable for use in standard, non-modified FDM printers. A detailed description of the fabrication of copper-based conductive filaments and the evaluation of electrical properties with the percolation threshold calculation has been presented in our previous work [24]. To develop composite filament that can be used in FDM printing, three different polymers were chosen as the matrix material to achieve the best possible processability.…”

Section: Conductive Composite Fabricationmentioning

confidence: 99%

Soldering of Electronics Components on 3D-Printed Conductive Substrates

Podsiadły¹,

Skalski²,

Słoma³

2021

Materials

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Rapid development of additive manufacturing and new composites materials with unique properties are promising tools for fabricating structural electronics. However, according to the typical maximum resolution of additive manufacturing methods, there is no possibility to fabricate all electrical components with these techniques. One way to produce complex structural electronic circuits is to merge 3D-printed elements with standard electronic components. Here, different soldering and surface preparation methods before soldering are tested to find the optimal method for soldering typical electronic components on conductive, 3D-printed, composite substrates. To determine the optimal soldering condition, the contact angles of solder joints fabricated in different conditions were measured. Additionally, the mechanical strength of the joints was measured using the shear force test. The research shows a possibility of fabricating strong, conductive solder joints on composites substrates prepared by additive manufacturing. The results show that mechanical cleaning and using additional flux on the composite substrates are necessary to obtain high-quality solder joints. The most repeatable joints with the highest shear strength values were obtained using reflow soldering together with low-temperature SnBiAg solder alloy. A fabricated demonstrator is a sample of the successful merging of 3D-printed structural electronics with standard electronic components.

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Section: Conductive Composite Fabricationmentioning

confidence: 99%

Soldering of Electronics Components on 3D-Printed Conductive Substrates

Podsiadły¹,

Skalski²,

Słoma³

2021

Materials

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“…Other works are focused on polymer modification and blends [ 4 , 5 , 17 ]. However, the most attractive seems to be the reinforced fused filaments with metal particles [ 18 , 19 , 20 ], clay minerals [ 6 , 21 , 22 , 23 ], graphene [ 8 , 24 , 25 , 26 ], glass [ 27 ], or carbon chopped fibers [ 28 , 29 ], and, more recently, continuous fibers [ 9 , 30 , 31 ].…”

Section: Introductionmentioning

confidence: 99%

Characterization of 3D Printing on Jute Fabrics

2021

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This work evaluates the feasibility to manufacture polylactic acid (PLA) composites using jute fiber fabrics. For characterization, PLA-fused filament was successfully deposed onto jute fabrics to print dog-bone tensile specimens (Type I specimen from ASTM D638). The jute fabrics were chemically modified, treated with flame retardant additives, and sprayed with aerosol adhesive to improve the mechanical properties of PLA/Jute fabric composites. The elastic modulus and the strength of PLA were higher than PLA composites, and the plastic deformation of the PLA composites was slightly lower than PLA. Tomography scans revealed the fabrics were well oriented and some adherence between jute fabrics and PLA. Viscoelastic properties of PLA composites resulted in the reduction in storage modulus and the reduction in intensity in the damping factor attributed to segmental motions with no variations in the glass transition temperature. Flame retardant and spray adhesive on jute fabrics promoted better response to time of burning than PLA and PLA with modified fibers. The results presented in this work lead to the need for a more detailed investigation of the effect of plant fiber fabrics as reinforcement of 3D printed objects for industrial applications.

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“…These devices would, in many cases, be impossible to produce using classical electronics as they include flexible, stretchable or transparent electrodes, antennas and displays. Additionally, these materials allow the construction of specialized components, such as structural electronic elements that can be used in both the automotive and aerospace industries as well as components for the use in the smart textiles area [5][6][7][8][9][10][11][12][13][14][15][16][17]. The solutions offered by printed electronics can improve both the functionality and reliability, while significantly decreasing the weight, size and cost of many of the systems and devices.…”

Section: Introductionmentioning

confidence: 99%

“…Materials that are particularly widely studied in this context are carbon nanotubes (CNTs) and graphene [4][5][6][7][8][9][10][11][12][13][14][15]. This is due to their light weight, high electrical and thermal conductivity, strength and low cost.…”

Section: Introductionmentioning

confidence: 99%

“…Furthermore, as most of the structures need to be deposited on a substrate or to be in a polymer-rich composite, this also defines the mechanical performance of the structure [6,8,9,11,14,15]. In the case of substrate-supported nanocarbon paths, these may be vulnerable to delamination and once delaminated they cannot form self-standing structures.…”

Section: Introductionmentioning

confidence: 99%

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Spun Carbon Nanotube Fibres and Films as an Alternative to Printed Electronic Components

et al. 2020

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Current studies of carbon nanotubes have enabled both new electronic applications and improvements to the performance of existing ones. Manufacturing of macroscopic electronic components with this material generally involves the use of printed electronic methods, which must use carbon nanotube (CNT) powders. However, in recent years, it has been shown that the use of ready-made self-standing macroscopic CNT assemblies could have considerable potential in the future development of electronic components. Two examples of these are spun carbon nanotube fibers and CNT films. The following paper considers whether these spun materials may replace printed electronic CNT elements in all applications. To enable the investigation of this question some practical experiments were undertaken. They included the formation of smart textile elements, flexible and transparent components, and structural electronic devices. By taking this approach it has been possible to show that CNT fibres and films are highly versatile materials that may improve the electrical and mechanical performance of many currently produced printed electronic elements. Additionally, the use of these spun materials may enable many new applications and functionalities particularly in the area of e-textiles. However, as with every new technology, it has its limitations, and these are also considered.

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Heterophase materials for fused filament fabrication of structural electronics

Cited by 24 publications

References 58 publications

Soldering of Electronics Components on 3D-Printed Conductive Substrates

Soldering of Electronics Components on 3D-Printed Conductive Substrates

Characterization of 3D Printing on Jute Fabrics

Spun Carbon Nanotube Fibres and Films as an Alternative to Printed Electronic Components

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