2011
DOI: 10.1117/12.885749
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Heterogeneously integrated microdisk lasers for optical interconnects and optical logic

Abstract: Optical interconnect and optical packet switching systems could take advantage of small footprint, low power lasers and optical logic elements. Microdisk lasers, with a diameter below 10µm and fabricated in InP membranes with a high index contrast, offer this possibility at the telecom wavelengths. The lasers are fabricated using heterogeneous integration of InP membranes on silicon-on-insulator (SOI) passive waveguide circuits, which allows to combine the active elements with compact, high-index contrast pass… Show more

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Cited by 1 publication
(3 citation statements)
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“…After interaction with the MR photons are removed from an opposite end of the fiber and go to an optoelectronic converter (for example, CCD), which transforms a light signal into an electric one. In order to remove the photons into the fiber more efficiently, one sometimes creates a diffraction grating at the ends of the waveguide [26,31]. A wavelength dependence of the transmission of the photons feeding the waveguide has minima at the frequencies corresponding to the eigen-frequencies of the MR.…”
Section: A Brief Review Of Quantum Network Models and Control Algoritmentioning
confidence: 99%
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“…After interaction with the MR photons are removed from an opposite end of the fiber and go to an optoelectronic converter (for example, CCD), which transforms a light signal into an electric one. In order to remove the photons into the fiber more efficiently, one sometimes creates a diffraction grating at the ends of the waveguide [26,31]. A wavelength dependence of the transmission of the photons feeding the waveguide has minima at the frequencies corresponding to the eigen-frequencies of the MR.…”
Section: A Brief Review Of Quantum Network Models and Control Algoritmentioning
confidence: 99%
“…So the principle of a laser operation, developed by the authors of [31] was based on the photon generation by InP microdisk of 3.75 μm radius, which was located on the plate fabricated by the "silicon on insulator" (SOI) technology. A 100 nm buffer polymer layer between the MR and the plate was deposited for a reliable adhesion.…”
Section: Modeling the Mr Spectrum And Read-out Quantum Chip Portmentioning
confidence: 99%
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