2015
DOI: 10.4071/isom-2015-tha35
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Heterogeneous Integration of a 300mm Silicon Photonics-CMOS Wafer Stack by Direct Oxide Bonding and Via-last 3D Interconnection

Abstract: A fully functional Si photonics and 65-nm CMOS heterogeneous 3D integration is demonstrated for the first time in a 300mm production environment. Direct oxide wafer bonding was developed to eliminate voids between SOI photonics and bulk Si CMOS wafers. A via-last, Cu through-oxide via (TOV) 3D integration was developed for low capacitance electrical connections with no impact on CMOS performance. 3D yield approaching 100% was demonstrated on >20,000 via chains.

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Cited by 5 publications
(2 citation statements)
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“…Recent growth in integrated photonics capabilities enables such an on-chip MLL implementation in principle. Moreover, recently demonstrated wafer-scale electronic-photonic integration enables the possibility of on-chip control loops with nanosecond response time [13,14] which, when designed together with onchip MLLs, could lead to demonstrations of fully-stabilized and fully-on-chip frequency combs and ultra-low-noise microwave oscillators.…”
Section: Introductionmentioning
confidence: 99%
“…Recent growth in integrated photonics capabilities enables such an on-chip MLL implementation in principle. Moreover, recently demonstrated wafer-scale electronic-photonic integration enables the possibility of on-chip control loops with nanosecond response time [13,14] which, when designed together with onchip MLLs, could lead to demonstrations of fully-stabilized and fully-on-chip frequency combs and ultra-low-noise microwave oscillators.…”
Section: Introductionmentioning
confidence: 99%
“…Such an integration scheme is a potential solution for controlling a large number of microring devices. Heterogeneous implementation of driver electronics with photonics has been explored at great length, and is a promising solution for application-specific control of photonic elements within the same substrate 44 . Such a solution localizes the optical interconnect and its control to a single substrate, and has the potential for multi-layer photonic-electronic integration.…”
Section: Impact Of Active Switchingmentioning
confidence: 99%