Heavy Liquid Metal Coolant – Lead–Bismuth and Lead – Technology

Zrodnikov, A. V.; Efanov, A. D.; Orlov, Yu. I.; Мартынов, П. Н.; Troyanov, V. M.; Rusanov, A. E.

doi:10.1023/b:aten.0000047678.35315.b6

Cited by 27 publications

(11 citation statements)

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“…This is not the first case of using liquid metals as a coolant for high powered equipment. The first nuclear‐powered submarine was launched in 1963 with a liquid alloy of lead and bismuth as the coolant for the exhaust from the nuclear components . However, this alloy is toxic and generally corrosive to structural materials, and alternative materials need consideration.…”

Section: Introductionmentioning

confidence: 99%

On the Wetting States of Low Melting Point Metal Galinstan® on Silicon Microstructured Surfaces

Davis

Ndao

2017

Adv Eng Mater

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The primary goal of this article is to measure the wetting characteristics of a low melting point metal to determine the efficacy of this type of material for possible use in thermal energy storage applications. Galinstan 1 , a commercially available alloy consisting of Gallium, Indium, and Tin is subjected to contact angle measurements on various silicon surfaces at varying temperatures. Due to the oxidation characteristics of Galinstan, all experiments are conducted in an inert nitrogen environment (<0.5 ppm oxygen) to maintain fluid-like properties. This work finds that although contact angle changes with substrate and surface structure, temperature has no observable effect on contact angle. Contact angles range from 141 on smooth silicon to greater than 160 on silicon micropillars. Although a temperature dependence is not observed over the range of temperatures studied, having wetting properties of Galinstan on various surfaces is a step toward better understanding the capabilities of this and similar materials in energy management.

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Section: Introductionmentioning

confidence: 99%

On the Wetting States of Low Melting Point Metal Galinstan® on Silicon Microstructured Surfaces

Davis

Ndao

2017

Adv Eng Mater

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“…In 1963, the first nuclear-powered submarine was launched with the liquid alloy of lead with bismuth as coolant [22]. The lead-bismuth coolant is generally corrosive for structural materials.…”

Section: Brief History For Traditional Liquid Metal Coolingmentioning

confidence: 99%

“…This would be based on that, when ∆<0, the cooling performance of the liquid metal is better than that of the water and vice versa. Equation (22) can be transformed into the following equation…”

Section: Evaluation Of Using Temperature Of Wallmentioning

confidence: 99%

Liquid metal cooling in thermal management of computer chips

Jing

2007

Front. Energy Power Eng. China

142

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With the rapid improvement of computer performance, tremendous heat generation in the chip becomes a major serious concern for thermal management. Meanwhile, CPU chips are becoming smaller and smaller with almost no room for the heat to escape. The total power-dissipation levels now reside on the order of 100 W with a peak power density of 400-500 W/cm 2 , and are still steadily climbing. As a result, it is extremely hard to attain higher performance and reliability. Because the conventional conduction and forcedair convection techniques are becoming incapable in providing adequate cooling for sophisticated electronic systems, new solutions such as liquid cooling, thermoelectric cooling, heat pipes, vapor chambers, etc. are being studied. Recently, it was realized that using a liquid metal or its alloys with a low melting point as coolant could significantly lower the chip temperature. This new generation heat transfer enhancement method raised many important fundamentals and practical issues to be solved. To accommodate to the coming endeavor in this area, this paper is dedicated to presenting an overall review on chip cooling using liquid metals or their alloys as coolant. Much more attention will be paid to the thermal properties of liquid metals with low melting points or their alloys and their potential applications in the chip cooling. Meanwhile, principles of several typical pumping methods such as mechanical, electromagnetic or peristaltic pumps will be illustrated. Some new advancement in making a liquid metal cooling device will be discussed. The liquid metal cooling is expected to open a new world for computer chip cooling because of its evident merits over traditional coolant.

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“…These conditions led to core damage of an early navy propulsion reactor. 28 Subsequently, Russian scientists gained valuable experience in managing corrosion through materials development and improved chemical control and purity of the coolant systems. 29 They also developed methods to minimize the radiation hazard from 210 Po produced in the lead-bismuth coolant.…”

Section: Liquid-metal-cooled Reactorsmentioning

confidence: 99%

Reactor Technology Options Study for Near-Term Deployment of GNEP Grid-Appropriate Reactors

Ingersoll¹,

Poore²

2007

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Heavy Liquid Metal Coolant – Lead–Bismuth and Lead – Technology

Cited by 27 publications

References 0 publications

On the Wetting States of Low Melting Point Metal Galinstan® on Silicon Microstructured Surfaces

On the Wetting States of Low Melting Point Metal Galinstan® on Silicon Microstructured Surfaces

Liquid metal cooling in thermal management of computer chips

Reactor Technology Options Study for Near-Term Deployment of GNEP Grid-Appropriate Reactors

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