2003
DOI: 10.1109/tns.2003.821815
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Heavy-ion broad-beam and microprobe studies of single-event upsets in 0.20-/spl mu/m SiGe heterojunction bipolar transistors and circuits

Abstract: Index Terms-Ground testing, modeling, SiGe, silicon germanium, single event effect, single event upset.

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Cited by 62 publications
(23 citation statements)
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“…The angles used for simulation correspond to the angles used in broadbeam testing [13][14][15]. The "Effective LET" from Fig.…”
Section: Ion Strike Simulation Methodologymentioning
confidence: 99%
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“…The angles used for simulation correspond to the angles used in broadbeam testing [13][14][15]. The "Effective LET" from Fig.…”
Section: Ion Strike Simulation Methodologymentioning
confidence: 99%
“…• A patterned subcollector (n for npn, p for pnp) on a doped substrate SiGe HBTs have been found to be quite tolerant to total ionizing dose (the amount of trapped charge accumulated over time found typically in the oxides and oxide interfaces of the device) and displacement effects (the result of lattice defects typically attributed to non-ionizing nuclear scattering reactions) [5][6][7][8][9][10][11], but are vulnerable to SEU [12][13][14][15][16]. [16].…”
Section: Event Effect (See)mentioning
confidence: 99%
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“…Previous investigations have examined the SEE response of 5HP and 7HP HBT circuits through both circuit testing [4,5] and modeling [6]. Charge collection modeling and measurement [7] studies in the 5HP process have also been conducted.…”
Section: Charge Collection Properties Of An Ecl Circuit Fabricated Usmentioning
confidence: 99%