Heating characteristics of convection reflow ovens

Illés, Béla; Harsányi, Gábor

doi:10.1016/j.applthermaleng.2008.10.014

Cited by 30 publications

(7 citation statements)

References 25 publications

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“…Illés and Harsányi (2009a, 2009b) reported that the heating capability of reflow ovens was affected by the oven’s construction. First, they studied the gas flow circumstances in the reflow oven using a stationary and isothermal gas flow model.…”

Section: Challenges In Modelling the Reflow Soldering Processmentioning

confidence: 99%

Thermo-mechanical challenges of reflowed lead-free solder joints in surface mount components: a review

Lau¹,

Khor

Soares

et al. 2016

SSMT

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Purpose The purpose of the present study was to review the thermo-mechanical challenges of reflowed lead-free solder joints in surface mount components (SMCs). The topics of the review include challenges in modelling of the reflow soldering process, optimization and the future challenges in the reflow soldering process. Besides, the numerical approach of lead-free solder reliability is also discussed. Design/methodology/approach Lead-free reflow soldering is one of the most significant processes in the development of surface mount technology, especially toward the miniaturization of the advanced SMCs package. The challenges lead to more complex thermal responses when the PCB assembly passes through the reflow oven. The virtual modelling tools facilitate the modelling and simulation of the lead-free reflow process, which provide more data and clear visualization on the particular process. Findings With the growing trend of computer power and software capability, the multidisciplinary simulation, such as the temperature and thermal stress of lead-free SMCs, under the influenced of a specific process atmosphere can be provided. A simulation modelling technique for the thermal response and flow field prediction of a reflow process is cost-effective and has greatly helped the engineer to eliminate guesswork. Besides, simulated-based optimization methods of the reflow process have gained popularity because of them being economical and have reduced time-consumption, and these provide more information compared to the experimental hardware. The advantages and disadvantages of the simulation modelling in the reflow soldering process are also briefly discussed. Practical implications This literature review provides the engineers and researchers with a profound understanding of the thermo-mechanical challenges of reflowed lead-free solder joints in SMCs and the challenges of simulation modelling in the reflow process. Originality/value The unique challenges in solder joint reliability, and direction of future research in reflow process were identified to clarify the solutions to solve lead-free reliability issues in the electronics manufacturing industry.

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Section: Challenges In Modelling the Reflow Soldering Processmentioning

confidence: 99%

Thermo-mechanical challenges of reflowed lead-free solder joints in surface mount components: a review

Lau¹,

Khor

Soares

et al. 2016

SSMT

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“…To start the process of reflow soldering, with the basic principle of soldering in saturated vapours, the stabilization of temperature and saturation of vapour inside the oven is a basic requirement (Géczy et al, 2013). For that matter, investigations are widespread in this topic, (Ankrom et al, 1989;Plotog et al, 2010aPlotog et al, , 2010bGéczy et al, 2013), with a general use of thermocouple-based temperature detection on the Printed Circuit Boards (PCBs) and inside the workspace as well (Livovsky and Pietrikova, 2017;Illés and Harsányi, 2009). Temperature detection is also important on PCB level.…”

Section: Introductionmentioning

confidence: 99%

“…For that matter, investigations are widespread in this topic, (Ankrom et al 1989), , (Géczy et al 2013), with a general use of thermocouple based temperature detection on the PCB-s and inside the workspace as well (Livovsky and Pietrikova, 2017) (Illés and Harsányi, 2009). Temperature detection is also important on PCB level.…”

mentioning

confidence: 99%

Advances in pressure sensing for vapour phase soldering process monitoring

Alaya

Géczy

Illés

et al. 2019

SSMT

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Soldering & Surface Mount TechnologyPurpose: To enable better productivity and assembling quality, the industry needs to provide precise control and measurements during assembling. In the paper, a special monitoring method is presented for Vapour Phase reflow Soldering (VPS) to enable improved process control and oven state identification.Design/methodology/approach: The work presents the investigation of the workspace with dynamic and gage type pressure sensors in fusion with thermocouples. Different sensors were evaluated to find an appropriate type. The relation between the temperature and the pressure was investigated, according to the setup of the oven. The effect of inserting a PCB on the pressure of the vapour inside the oven was also investigated with the pressure/power functions.Findings (mandatory): It was found, that the novel gage type sensors enable better precision than solutions seen in previous literature. The sensors are able to monitor the decreasing vapour concentration when a PCB is inserted to the workspace. It was found, that there is a suggested minimum power to sustain a well-developed vapour column for soldering in saturated vapour. An inflexion point highlights this in the pressure/power function, in accordance with the temperature/power curve.Originality/value (mandatory): The research present original works with aspects of a novel sensor fusion concept and work space monitoring for better process control and improved soldering quality.

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“…Vapour Phase Soldering (VPS) is a reflow soldering method, which is more complex from the aspect of heat transfer than conventional convection- [1,2,3], or IR heating [4] based reflow processes.…”

Section: Introductionmentioning

confidence: 99%

Refined Approach on Controlling Heat Transfer in a Vapour Phase Soldering Oven

Géczy

Kiss

Alaya

et al. 2019

2019 42nd International Spring Seminar on Electronics Technology (ISSE)

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The control of soldering temperature profiles is crucial in any reflow process of electronic assemblies. In our paper a novel approach is presented on the control of the temperature during vapour phase soldering process. In the given case the electronic surface mounted assembly to be soldered is immersed into the vapour with a special sample holder system and moved up and down by a flexible LabVIEW hardware and software configuration. It was found that with proper data acquisition and appropriate programming, the system is able to follow pre-programmed soldering profiles with small deviation. The paper presents the system, the experimental configuration and initial results obtained with the setup. The proposed setup can improve the current view on proper heat transfer handling in VPS ovens, and also enables precise control on investigations with different low-temperature solder alloys, and most importantly, thermally sensitive substrates, such as biodegradable epoxies, or moulded interconnect devices.

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Heating characteristics of convection reflow ovens

Cited by 30 publications

References 25 publications

Thermo-mechanical challenges of reflowed lead-free solder joints in surface mount components: a review

Thermo-mechanical challenges of reflowed lead-free solder joints in surface mount components: a review

Advances in pressure sensing for vapour phase soldering process monitoring

Refined Approach on Controlling Heat Transfer in a Vapour Phase Soldering Oven

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