Heataerodynamic efficiency of small size heat transfer surfaces for cooling thermally loaded electronic components

Rohachev, V.A.; Терех, Олександр Михайлович; Baranyuk, Alexandr; Nikolaenko, Yu. E.; Zhukova, Yu. V.; Руденко, А. И.

doi:10.1016/j.tsep.2020.100726

Cited by 9 publications

(2 citation statements)

References 55 publications

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“…The heat and mass transfer may be enhansed by using various developed surfaces [14][15][16][17], showing high efficiency due to the improvement of hydrodynamic and heat exchange indicators at the flow of liquids and air flows in the channels.…”

Section: Introductionmentioning

confidence: 99%

Intensification of heat and mass transfer of the gas channel of the multi-temperature condensation filter

Malevany

Коновалов

2022

J. Phys.: Conf. Ser.

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The principle of operation and features of hydrodynamics and heat-mass transfer in the working channel of a multi-temperature condensation filter for gas purification are described. Promising methods of gas flow purification using porous surfaces are described. The modeling and comparison of the laminar air flow in channels of various shapes: in a flat channel, in a channel with webs and in a spiral channel are performed. An analysis of their effectiveness is carried out.

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Section: Introductionmentioning

confidence: 99%

Intensification of heat and mass transfer of the gas channel of the multi-temperature condensation filter

Malevany

Коновалов

2022

J. Phys.: Conf. Ser.

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“…Similar results were obtained in [17] but with the use of CFD modelling. Generalization of experimental data on thermal and aerodynamic characteristics of heat sinks with different types of finning, including fins with partial cut, is presented in [18]. Partially cut fins have also proven themselves well in studies of thermo-aerodynamic characteristics of transversal finned tube packages.…”

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confidence: 99%

Experimental investigation of heat transfer and aerodynamic drag of novel heat sinks with lamellar fins

Terekh,

Rudenko,

Alekseik

2024

Archives of Thermodynamics

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Heat transfer and aerodynamic drag of novel small-sized heat sinks with lamellar fins, designed for electronic cooling, were experimentally investigated under conditions of forced convection in the range of Reynolds numbers 1 250–10 500. It was found that a gradual reduction in the fin spacing from 6 mm to 3 mm with a 29° angle of taper between the outermost fins leads to an increase in the heat transfer intensity by 15–32% with a significant increase in aerodynamic drag compared to the surface with a constant fin spacing of 6 mm. Incomplete cross-section cutting of fins at the relative depth of 0.6 in addition to the gradual reduction in the fin spacing provides aerodynamic drag decrease by 5–20% and increase of heat transfer intensity by 18–20% in comparison with the similar heat sink without fins cutting. Proposed novel designs of heat sinks enabled us to decrease by 7°С–16°С the maximum overheating of the heat sink's base in the flow speed range from 2.5 m/s to 7.5 m/s at constant heat load. To ensure a constant value of maximum overheating of the heat sink base the inlet flow velocity for the surface with constant fin spacing should be 1.6–2 times higher than that for the heat sink with 29° taper angle between outermost fins and partially fins cutting. In this case, the aerodynamic drag for the latter will be higher only by 1.6–2.7 times, which is quite acceptable.

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Review on thermal management technologies for electronics in spacecraft environment

Lv,

Wang,

Meng

et al. 2024

Energy Storage and Saving

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Heataerodynamic efficiency of small size heat transfer surfaces for cooling thermally loaded electronic components

Cited by 9 publications

References 55 publications

Intensification of heat and mass transfer of the gas channel of the multi-temperature condensation filter

Intensification of heat and mass transfer of the gas channel of the multi-temperature condensation filter

Experimental investigation of heat transfer and aerodynamic drag of novel heat sinks with lamellar fins

Review on thermal management technologies for electronics in spacecraft environment

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