2017 International Conference on Electronics Packaging (ICEP) 2017
DOI: 10.23919/icep.2017.7939353
|View full text |Cite
|
Sign up to set email alerts
|

Heat transfer performance of uni-directional porous heat sink for cooling of next generation on-vehicle inverter

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2

Citation Types

0
2
0

Year Published

2021
2021
2022
2022

Publication Types

Select...
1
1

Relationship

0
2

Authors

Journals

citations
Cited by 2 publications
(2 citation statements)
references
References 5 publications
0
2
0
Order By: Relevance
“…Although the results were presented for IGBTs, the high thermal flux capability of porous heat sinks makes this technology suitable for WBGs. For instance, Takai et al (2017) suggested the use of a porous heat sink for a GaN-based inverter [103]. The optimal structure of a cold plate can also increase the heat transfer capability of the device.…”
Section: Other Promising Cooling Approachesmentioning
confidence: 99%
See 1 more Smart Citation
“…Although the results were presented for IGBTs, the high thermal flux capability of porous heat sinks makes this technology suitable for WBGs. For instance, Takai et al (2017) suggested the use of a porous heat sink for a GaN-based inverter [103]. The optimal structure of a cold plate can also increase the heat transfer capability of the device.…”
Section: Other Promising Cooling Approachesmentioning
confidence: 99%
“…The present cooling design provides a low Rth = 0.185 K/W and a low inlet pressure Pin = 5 Although the results were presented for IGBTs, the high thermal flux capability o heat sinks makes this technology suitable for WBGs. For instance, Takai et al (2 gested the use of a porous heat sink for a GaN-based inverter [103]. The optimal structure of a cold plate can also increase the heat transfer cap the device.…”
Section: Other Promising Cooling Approachesmentioning
confidence: 99%