Heat Transfer in Electronic Packages

Simons, R.E.; Antonetti, Vincent W.; Nakayama, Wataru; Oktay, S.

doi:10.1007/978-1-4615-4086-1_4

Cited by 24 publications

(6 citation statements)

References 31 publications

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“…The case of natural convection from heated vertical walls in a triangular cavity is of special interest due to its direct application in electronics cooling [12][13][14], where air has been and continues to be the most widely used working fluid for heat rejection [14]. In fact, a configuration of relevance to the electronic industry consists of a heated vertical wall being part of a square or rectangular cavity [12,13], where heat exchange by natural convection takes place between the heated vertical wall and the opposite cold wall or between the heated vertical wall and an adjacent cold wall [9]. However, in this type of configurations it is clear that natural convection cooling does not provide a constant-temperature bath along the heated vertical wall, producing the appearance of hot spots which if not properly managed, may exceed critical temperatures affecting adversely the performance and reliability of electronic components.…”

Section: Introductionmentioning

confidence: 99%

“…Its peculiarity revolves around a combination of thermal boundary conditions. This configuration may find application in the miniaturization of electronic packaging subjected to space and/or weight constraints, as stated by Simons et al [12] and Bar-Cohen et al [13]. In this work, the vertical wall is uniformly heated with a prescribed heat flux, a prescribed cold temperature is assigned at the inclined wall, while the upper horizontal wall is assumed thermally insulated.…”

Section: Introductionmentioning

confidence: 99%

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Natural convection air flow in vertical upright-angled triangular cavities under realistic thermal boundary conditions

2016

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This paper presents an analytical and numerical computation of laminar natural convection in a collection of vertical upright-angled triangular cavities filled with air. The vertical wall is heated with a uniform heat flux; the inclined wall is cooled with a uniform temperature; while the upper horizontal wall is assumed thermally insulated. The defining aperture angle φ is located at the lower vertex between the vertical and inclined walls. The finite element method is implemented to perform the computational analysis of the conservation equations for three aperture angles φ = 15º, 30º, and 45º and height-based modified Rayleigh numbers ranging from a low Ra = 0 (pure conduction) to a high 10 9. Numerical results are reported for the velocity and temperature fields as well as the Nusselt numbers at the heated vertical wall. The numerical computations are also focused on the determination of the value of the maximum or critical temperature along the hot vertical wall and its dependence with the modified Rayleigh number and the aperture angle.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Natural convection air flow in vertical upright-angled triangular cavities under realistic thermal boundary conditions

2016

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“…With the miniaturization of electronic devices and the increased integration density, the effective dissipation of heat becomes an important requirement for ensuring trouble-free operation [ 1 , 2 ]. The limited space available for heat dissipation, the high energy densities and the dynamically changing, and often unknown, locations of heat sources in micro- and nano-devices [ 3 ], make it difficult to apply conventional thermal management strategies and techniques of heat transmission, such as convection-driven heat fins, fluids, heat pastes, and metal wiring [ 3 ]. It is a challenge to find the best material and structure for providing excellent heat transfer within the severe space constraints.…”

Section: Introductionmentioning

confidence: 99%

Optimizing the design of nanostructures for improved thermal conduction within confined spaces

Kou

Qian

et al. 2011

Nanoscale Res Lett

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Maintaining constant temperature is of particular importance to the normal operation of electronic devices. Aiming at the question, this paper proposes an optimum design of nanostructures made of high thermal conductive nanomaterials to provide outstanding heat dissipation from the confined interior (possibly nanosized) to the micro-spaces of electronic devices. The design incorporates a carbon nanocone for conducting heat from the interior to the exterior of a miniature electronic device, with the optimum diameter, D0, of the nanocone satisfying the relationship: D02(x) ∝ x1/2 where x is the position along the length direction of the carbon nanocone. Branched structure made of single-walled carbon nanotubes (CNTs) are shown to be particularly suitable for the purpose. It was found that the total thermal resistance of a branched structure reaches a minimum when the diameter ratio, β* satisfies the relationship: β* = γ-0.25bN-1/k*, where γ is ratio of length, b = 0.3 to approximately 0.4 on the single-walled CNTs, b = 0.6 to approximately 0.8 on the multiwalled CNTs, k* = 2 and N is the bifurcation number (N = 2, 3, 4 ...). The findings of this research provide a blueprint in designing miniaturized electronic devices with outstanding heat dissipation.PACS numbers: 44.10.+i, 44.05.+e, 66.70.-f, 61.48.De

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“…Введение. Для управления мощными электрическими процессами в устройствах силовой электроники необходимо использовать эффективные решения для отвода тепла от активных компонентов, расположенных на монтажных диэлектрических подложках [1][2][3][4][5][6][7]. Одним из таких решений является использование теплопроводящих подложек с высокой теплопроводностью [8,9].…”

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Investigation of Heat Flux Propagation in Heat-Conducting Oxide Substrates with Different Heat Conductivity by the Linear Heat Source Method

Vrublevsky

Chernyakova

Muratova

et al. 2020

Izv. vysš. učebn. zaved. Ross., Radioèlektron.

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Introduction. For controlled thermal management of power electronics devices, an important task is to increase the efficiency of heat removal from active components. Aim. To introduce a new approach to placing a linear contact-type heat source on the surface of thin samples in order to study the features of propagation of heat fluxes in oxide substrates from materials with different thermal conductivities. Methods and materials. The paper presents the results of studies of the propagation of heat fluxes in oxide substrates with different thermal conductivity (glassceramic and aluminum oxide ceramic - polycor). To generate the heat flux, a linear heat source was used, for which an electrically conductive carbon fiber was applied. Results. Thermograms and temperature distribution profiles were obtained at different periods of heating time on the surface of the substrate with a heating element and on its reverse side. It was shown that the placement of the linear heat source, implemented using an electrically conductive carbon filament, on the surface of the studied samples and time monitoring of thermograms from two opposite surfaces of the samples allowed to obtain data for evaluating the thermal properties of oxide substrates. The distribution of the heat flux in a homogeneous material near the generation point had the form of a cone of a heat pipe with a base on the surface with a heat source. The thermal cone for an aluminum oxide ceramic substrate had a larger angle of inclination than that in the case of glassceramic. Conclusion. The results obtained allowed to propose a method for reduction of thermal resistance of a heatconducting substrate by creating conditions for increasing the area of heat-conducting section.

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Heat Transfer in Electronic Packages

Cited by 24 publications

References 31 publications

Natural convection air flow in vertical upright-angled triangular cavities under realistic thermal boundary conditions

Natural convection air flow in vertical upright-angled triangular cavities under realistic thermal boundary conditions

Optimizing the design of nanostructures for improved thermal conduction within confined spaces

Investigation of Heat Flux Propagation in Heat-Conducting Oxide Substrates with Different Heat Conductivity by the Linear Heat Source Method

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