2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) 2019
DOI: 10.1109/therminic.2019.8923465
|View full text |Cite
|
Sign up to set email alerts
|

Heat Transfer in Circuit Boards with Low-Density Area Occupancy

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...

Citation Types

0
0
0

Publication Types

Select...

Relationship

0
0

Authors

Journals

citations
Cited by 0 publications
references
References 3 publications
0
0
0
Order By: Relevance

No citations

Set email alert for when this publication receives citations?