2022
DOI: 10.1016/j.mtphys.2022.100857
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Heat transfer enhancement of spray cooling by copper micromesh surface

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Cited by 7 publications
(3 citation statements)
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“…97 Furthermore, it is closely related to the surface wettability, the nucleation sites of the bubbles, and the surface area of heat transfer during boiling. 98 After the BISA of the alumina nanofluid, a heterogeneous coating was rapidly generated on the smooth aluminum substrate, which roughened the surface. 99 The larger the concentration of the nanofluid for the BISA was, the rougher the coating surface became after the BISA.…”
Section: Phase-change Heat Transfer On Films With Nanoengineered Surf...mentioning
confidence: 99%
“…97 Furthermore, it is closely related to the surface wettability, the nucleation sites of the bubbles, and the surface area of heat transfer during boiling. 98 After the BISA of the alumina nanofluid, a heterogeneous coating was rapidly generated on the smooth aluminum substrate, which roughened the surface. 99 The larger the concentration of the nanofluid for the BISA was, the rougher the coating surface became after the BISA.…”
Section: Phase-change Heat Transfer On Films With Nanoengineered Surf...mentioning
confidence: 99%
“…To address such an issue, this work creatively proposes to arrange multiple sets of ridges perpendicular to each other on superhydrophobic surfaces with an interspace smaller than the droplet diameter, which can not only facilitate the independent retraction of droplet subsets for reducing the capillary inertia time but also diminish the influence of the impact position on the contact time. Specifically, the impact of droplets on copper mesh structures has garnered widespread attention. For instance, Sen et al discovered that during droplet impact on suspended copper mesh, recoil ejection driven by cavity-collapse singularity could achieve satellite-free ejection of single droplets. This technique can generate monodisperse droplets, replacing traditional nozzles and avoiding issues such as nozzle clogging, thereby achieving breakthroughs in printing technology.…”
Section: Introductionmentioning
confidence: 99%
“…With the decrease of size and increase of power for modern electronics, thermal management has become a critical prerequisite to maintain device efficiency and reliability. By atomizing the cooling agent into microscale droplets and impacting hot substrates, spray cooling exhibits high heat dissipation efficiency and temperature uniformity . However, during the liquid impact process, the splash of liquid droplets result in inhomogeneous heat dissipation and the retraction of spread liquid film reduces the liquid–solid contact area, which hinder the improvement of heat transfer efficiency during the spray cooling process. Hence, it is significant to study the liquid impact behavior to achieve controllable liquid deposition, which is crucial for thermal management of spray cooling, but also significant for various industrial applications, such as reducing the waste of pesticide in agriculture, improving the precision of patterns during inkjet printing, fabricating uniform functional films by drop-casting, and so forth. …”
Section: Introductionmentioning
confidence: 99%