Heat Transfer Enhancement for On-Chip Cooling Application Using Novel Composite Heat Sink—Comparative Numerical Study

Bakhirathan, Asokan; Raveendar, Giridhar; Lachireddi, Gangadhara Kiran Kumar

doi:10.1109/tcpmt.2021.3086184

Cited by 4 publications

(1 citation statement)

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“…The thermodynamic characteristics [9,[43][44][45][46][47] of the nanofluid play a significant role in influencing fluid flow and heat transfer dynamics. In this particular investigation, a coolant is employed consisting of CuO nanoparticles suspended in water for one case, while another case employs Al2O3 nanoparticles suspended in water as the coolant.…”

Section: Nanofluid Propertiesmentioning

confidence: 99%

Numerical Simulation for Cooling of Integrated Toroidal Octagonal Inductor Using Nanofluid in a Microchannel Heat Sink

Benhadda,

Mokhtaria Derkaoui,

Hayet Kharbouch

et al. 2023

Metall Mater Eng

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This paper presents a comprehensive numerical simulation study focused on the cooling of integrated toroidal octagonal inductor using nanofluids within a microchannel heat sink. The investigation utilizes COMSOL Multiphysics 6.0 integrated with the Fluid Flow and Conjugate Heat Transfer Module. The primary objective is to explore and understand fluid flow and heat transfer characteristics within the integrated inductor. The study involves testing three distinct fluids, water, CuO-water nanofluid, and Al2O3-water nanofluid, under laminar flow conditions within microchannels. The choice of fluid plays a significant role in heat transfer, interacting with the microchannel geometry to optimize performance. Three-dimensional computational fluid dynamics (CFD) models are meticulously developed; focusing on toroidal inductors equipped with micro pin fins heat sinks. The study commences by detailing the geometry of the micro coil and the integrated heat sink. The simulation encompasses a mathematical model that captures the intricate interplay between the governing Navier-Stokes equations for fluid dynamics and the heat transfer equations within the integrated inductor. As φ increases, temperature, viscosity, and pressure decrease. CuO-water and Al2O3-water nanofluids play a significant role in influencing laminar flow and key thermal parameters in the toroidal inductor. These nanofluids, which consist of base fluids (water) with dispersed nanoparticles (CuO or Al2O3), are employed as cooling agents to enhance heat transfer. The presence of nanoparticles in the fluid alters its thermal properties, leading to changes in the flow dynamics and overall heat dissipation within the toroidal inductor.The laminar flow characteristics are affected by the nanofluid's viscosity, density, and thermal conductivity. Additionally, the Nusselt number, Reynolds number, and thermal resistance are key thermal parameters that reflect the performance of the cooling system. The nanofluid's influence on these parameters is crucial for understanding and optimizing the thermal management of the integrated toroidal inductor. The enhancement of heat dissipation in the toroidal inductor is achieved through improved thermal properties of the nanofluid. Higher nanoparticle concentrations result in better heat transfer rates, leading to lower temperatures in the toroidal inductor. This, in turn, improves the overall efficiency and performance of the cooling system. The viscosity of the nanofluid is influenced by the presence of nanoparticles. The pressure within the microchannels is also affected by the nanoparticle concentration. An increase in φ can lead to changes in pressure drop along the microchannels. Understanding these variations is crucial for designing an effective cooling system.

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