Heat transfer characteristics and LED heat sink application of aluminum plate oscillating heat pipes

Lin, Zijian; Wang, Shuangfeng; Huo, Jiepeng; Hu, Yi; Chen, Jin-Jian; Zhang, Winston; Lee, Eton

doi:10.1016/j.applthermaleng.2011.03.003

Cited by 103 publications

(39 citation statements)

References 9 publications

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“…Appearing in the 1990s, oscillating heat pipes (OHPs) have been proved to have the advantages of small size, low cost, simple structure (without capillary core), high conductivity and strong adaptability (bent arbitrarily, more flexible mode for heating and cooling ) after more than twenty years of research [20][21][22][23][24][25][26][27], so they have good application prospect in the heat dissipation area such as cooling of electronics [28], light-emitting diode (LED) [29], battery thermal management (BTM) [30] and so on. In terms of the shape, the OHP can be divided into plate type and tube type.…”

Section: Introductionmentioning

confidence: 99%

Experimental investigation on thermal performance of phase change material coupled with closed-loop oscillating heat pipe (PCM/CLOHP) used in thermal management

Zhao

Rao

Liu

et al. 2016

Applied Thermal Engineering

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Section: Introductionmentioning

confidence: 99%

Experimental investigation on thermal performance of phase change material coupled with closed-loop oscillating heat pipe (PCM/CLOHP) used in thermal management

Zhao

Rao

Liu

et al. 2016

Applied Thermal Engineering

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“…[5,7], and Refs. [2,3,5,7,[10][11][12], respectively. A detailed review about the relevant researches was summarized by Zhang and Faghri [14].…”

Section: Introductionmentioning

confidence: 98%

“…For instance, the effects of hydraulic diameter, the number of turns, working fluids, filling liquid ratio, inclined angles, and heat transfer rate on the performance of PHP were reported by Refs. [2,[4][5][6][7][8][9][10][11][12], Refs. [4,7,13], Refs.…”

Section: Introductionmentioning

confidence: 99%

Theoretical study of oscillatory phenomena in a horizontal closed-loop pulsating heat pipe with asymmetrical arrayed minichannel

Chiang

Chien

Chen

et al. 2012

International Communications in Heat and Mass Transfer

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“…This structure improves on LED thermal cooling models by incorporating materials with high heat conductivity, a heat sink, and a forced cooling fan and by reducing T j temperature to meet standard lighting requirements [13][14][15][16][17].…”

Section: Introductionmentioning

confidence: 99%

Effect of heat convection on the thermal and structure stress of high-power InGaN light-emitting diode

Hsu

Huang

2014

J Therm Anal Calorim

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In this study, two models are investigated:(1) the convection cooling of high-power indium-galliumnitride light-emitting diodes (LEDs) and (2) the effects of thermal stress distribution. The first model chip (model A) has power of 1 and 3 W and dimensions of 1 mm 9 1 mm 9 0.005 mm, whereas the second model chip (model B) has power of 6 and 10 W and dimensions of 1.8 mm 9 1.8 mm 9 0.005 mm. The results of an analysis of natural convection, forced cooling, and thermal stress are compared with 1, 3, 6, and 10 W thermal specification data. High heat conductivity Al 2 O 3 material used as a printed circuit board (PCB) facilitates the heat conduction and thermal cooling of high-power LEDs and thus increases the strength of the structure. This LED structure model is used in full-scale packaging structures. The wire bonding convection cooling and effect of thermal stress distribution of this packaging design are investigated. We simulate thermal performance and effect of thermal stress distribution of the LEDs using a finite element method with ANSYS software. Heat transfer is coupled with heat conduction, heat convection, and thermal radiation, with the distribution of thermal stress equivalent to that of the von Mises criterion stress. LED is attached to a silicon substrate by wire bonding; the die bond material used is epoxy. LED packaging material is important. If the LED lighting power is fixed, it can increase the convection cooling coefficient, decreases the T j temperature, and the distribution of structural stress. The T j temperature is stable when the heat transfer coefficient had a critical or optimal value. Thermal cooling performance and overall structural strength can be improved when the LED is mounted on the Al 2 O 3 PCB material and heat sink. The models are employed accurately to determine the heat transfer effect, structural strength, life span, performance enhancement, and efficiency.

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Heat transfer characteristics and LED heat sink application of aluminum plate oscillating heat pipes

Cited by 103 publications

References 9 publications

Experimental investigation on thermal performance of phase change material coupled with closed-loop oscillating heat pipe (PCM/CLOHP) used in thermal management

Experimental investigation on thermal performance of phase change material coupled with closed-loop oscillating heat pipe (PCM/CLOHP) used in thermal management

Theoretical study of oscillatory phenomena in a horizontal closed-loop pulsating heat pipe with asymmetrical arrayed minichannel

Effect of heat convection on the thermal and structure stress of high-power InGaN light-emitting diode

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