Heat transfer behavior of as-processed and cleaned picosecond pulse laser processed copper

Anderson, Mark; Costa-Greger, Justin; Ediger, Aaron; Zuhlke, Craig; Alexander, Dennis R.; Gogos, George; Shield, Jeffrey E.

doi:10.1016/j.tsep.2021.101105

Cited by 3 publications

(1 citation statement)

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“…The Cu oxide layer that is inherent to the surface when applying FLSP to Cu in ambient conditions was reduced using two different techniques. The first method of reduction was a citric acid cleaning (CAC) of the Cu FLSP surfaces similar to the procedure used by Anderson et al, 2 where the samples were submergered in a 0.5 M solution of citric acid solution for 5 minutes. After this, the samples were submerged in ethanol and were placed in an ultrasonic bath for 25 minutes.…”

Section: Oxide Layer Reductionmentioning

confidence: 99%

Functionalization of copper for enhanced electrocatalytic reduction of carbon dioxide via ultrashort pulse laser surface processing

Kaufman,

El-Harairy,

Sarin

et al. 2024

Laser-Based Micro- And Nanoprocessing XVIII

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Copper substrates were functionalizaed using ultrashort pulsed laser surface processing to create micro-and nanoscale features to enhance the electrocatalytic nature of the surfaces for the electrochemical reduction of carbon dioxide. Post-processing of the laser-functionalized copper surfaces was carried out to increase the efficiency and stability of the electrocatalyst. A maximum current density of 55 mA/cm 2 was achieved during carbon dioxide reduction reaction (CO2RR) over the laser processed copper, and the stability of the surface was enhanced by modifying the chemical and physical nature of the surfaces. The surfaces were chemically and physically analyzed before and after the reduction reaction.

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Section: Oxide Layer Reductionmentioning

confidence: 99%