2022
DOI: 10.1007/s12206-022-0545-4
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Heat transfer analysis on wafer annealing process in semiconductor multi-wafer furnace using CFD simulation

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Cited by 4 publications
(1 citation statement)
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“…Díaz-Ovalle et al [27] reported that the baffle plate geometry in an electrical convective furnace could have an important influence on the temperature uniformity of the furnace and the preheating time of the furnace. Using a 3D numerical model, Tan et al [28] simulated the heat transfer during annealing in a vertical furnace to recommend design changes that would improve thermal uniformity across the stacked wafers. In the simulation, it was found that the heat loss at the process door was greater than the heat loss at the top header.…”
Section: Introductionmentioning
confidence: 99%
“…Díaz-Ovalle et al [27] reported that the baffle plate geometry in an electrical convective furnace could have an important influence on the temperature uniformity of the furnace and the preheating time of the furnace. Using a 3D numerical model, Tan et al [28] simulated the heat transfer during annealing in a vertical furnace to recommend design changes that would improve thermal uniformity across the stacked wafers. In the simulation, it was found that the heat loss at the process door was greater than the heat loss at the top header.…”
Section: Introductionmentioning
confidence: 99%