Heat-Resistant Organic Matrices Quo Vadis? (Review)

Abstract

The introduction is a brief review of the characteristics desired for heat-resistant composite matrices, and the two possible approaches based on linear polymers and telechelic oligomers that can be cross-linked during use. Special attention is paid to cross-linkable oligomers, whose use currently poses fewer problems. The different structures in question, i.e. bismaleimides, bismaleimides (modified by cyanates or epoxies), bisnadimides, acetylene and propargylic compounds, are discussed in terms of chemistry (stability of oligomers, mode of polymerization, aging) and mechanical properties (ductility). Several solutions little used at the present time (semi-interpenetrated networks, molecular composites, polymerizable molecular assemblies, hyper branched oligomers and liquid crystal monomers, etc.) are discussed in terms of the future. There may be technical solutions for use up to 300°C, but industrial development is far from being resolved because of, among other things, the small market for these products.