Heat-resistance study of thermal release tape

Abstract

Thermal release tape is an unique tape that has three layers structure, including adhesive layer base film and thermal release layer. These tapes behave like adhesive tape at room temperature but can be easily removed by heating at high temperature when we want to release this tape [1,2]. Because these tapes are available in rolls for all automatic or manual wafer mounting systems, thermal release tape is widely applied in semiconductor package industry.In this paper, heat-resistance of thermal release tape were studied under some thermal conditions, such as (Y-30) 0 C/3hr (Y-20) 0 C/3hr (Y-10) 0 C/3hr and Y 0 C/3hr and we examine foaming phenomenon of tape. These results show that tape will lose fully foaming ability and become more difficultly to be released after long time heating on high temperature.