Heat rejection limits of air cooled plane fin heat sinks for computer cooling

Development of a plate-pin fin heat sink and its performance comparisons with a plate fin heat sink

“…Heat transfer performance of a PPFHS used for a CPU cooling will be discussed here. The geometry parameters of a PFHS and a copper spreader are described in reference [9]. The optimum geometry parameters for fin thickness and fin gap are 0.8 and 2.0 mm respectively in the PFHS [9].…”

“…The geometry parameters of a PFHS and a copper spreader are described in reference [9]. The optimum geometry parameters for fin thickness and fin gap are 0.8 and 2.0 mm respectively in the PFHS [9]. The sizes of plate fins and fin base of the PPFHS are the same as that of the PFHS, and the fin gap is assumed as 2.5 mm in the PPFHS.…”

An experimental study on the thermal and hydraulic performances of nanofluids flow in a miniature circular pin fin heat sink

“…Heat sink is a component to dissipate heat from the electronic devices by means of temperature difference between the system and the heat transfer fluid. The purposes of using of a heat sink are divided in two folds: (1) to increase the heat dissipation rate for improving the thermal performance of the system, and (2) to augment the reliability and functionality of the electronic device. In the past, the air-cooled method is very popular.…”

“…In the past, the air-cooled method is very popular. However, a limitation due to the thermal performance of air is reached [1,2]. Later, the water-cooled method is used to compensate the disadvantage of the air-cooled systems.…”

Development of a piezoelectric pump using hinge-lever amplification mechanism

“…As a result of these trends, heat generation rates of the electronic components have rapidly increased. Traditional electronics cooling solutions, such as a forced air convection cooling method using conventional fan assembled fin-array heat sinks and heat pipe technology, are unsuitable for counteracting these large heat generation rates [1,2]. Among current state-of-the-art technologies, forced liquid cooling using a pump and heat sinks is an attractive solution for dissipating the heat flux from the high-power electronic devices.…”