Heat-driven liquid metal cooling device for the thermal management of a computer chip

Ma, Kun; Liu, Jing

doi:10.1088/0022-3727/40/15/055

Cited by 127 publications

(49 citation statements)

References 21 publications

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“…The thermal conductivity of pure Ga is 28.7 kcal/m•h•°C, which is much higher than the thermal conductivity of air or water [23]. Furthermore, the liquidity and high thermal conductivity of Ga-based liquid metals allows them to be used as coolant agents for several applications, such as microdevices [24].…”

Section: Thermal Properties and Applicationsmentioning

confidence: 99%

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Recent progress on liquid metals and their applications

Ren

et al. 2018

Advances in Physics: X

100

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Gallium-based liquid metals show excellent thermal and electrical conductivities with low viscosity and non-toxicity. Their melting points are either lower than or close to room temperature, which endows them with additional advantages in comparison to the solid metals; for example, they are flexible, stretchable and reformable at room temperature. Recently, great improvements have been achieved in developing multifunctional devices by using Ga-based liquid metals, including actuators, flexible circuits, bio-devices and self-healing superconductors. Here, we review recent research progress on Gallium-based liquid metals, especially on the applications aspects. These applications are mainly based on the unique properties of liquid metals, including low melting point, flexible and stretchable mechanical properties, excellent electrical and thermal conductivities and biocompatibility.

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Section: Thermal Properties and Applicationsmentioning

confidence: 99%

“…Heat dissipation management is important for cooling the compact electronic packages including central processing unit (CPU) in computers [23]. The evolution of micro/nano-devices has significantly enhanced the capability of liquid cooling systems.…”

Section: Coolantmentioning

confidence: 99%

Recent progress on liquid metals and their applications

Ren

et al. 2018

Advances in Physics: X

100

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“…In some situations, the driving of a liquid metal can be done by the waste heat, which leads to the technique in the sense with zero net energy input [100]. Furthermore, the fact that the system has no moving mechanical parts eliminates such tough issues as leakage, wearing out or sticking.…”

Section: Mhd Pumpmentioning

confidence: 99%

“…Ma and Liu [100] realized the working of the MHD pump with DC current less than 1 A and demonstrated the feasibility of using waste heat to drive a thermoelectric generator (TEG) and thus the flowing of liquid gallium. The advancement enables the MHD pump to come into real application, as shown in Fig.…”

Section: Mhd Pumpmentioning

confidence: 99%

Liquid metal cooling in thermal management of computer chips

Jing

2007

Front. Energy Power Eng. China

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141

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With the rapid improvement of computer performance, tremendous heat generation in the chip becomes a major serious concern for thermal management. Meanwhile, CPU chips are becoming smaller and smaller with almost no room for the heat to escape. The total power-dissipation levels now reside on the order of 100 W with a peak power density of 400-500 W/cm 2 , and are still steadily climbing. As a result, it is extremely hard to attain higher performance and reliability. Because the conventional conduction and forcedair convection techniques are becoming incapable in providing adequate cooling for sophisticated electronic systems, new solutions such as liquid cooling, thermoelectric cooling, heat pipes, vapor chambers, etc. are being studied. Recently, it was realized that using a liquid metal or its alloys with a low melting point as coolant could significantly lower the chip temperature. This new generation heat transfer enhancement method raised many important fundamentals and practical issues to be solved. To accommodate to the coming endeavor in this area, this paper is dedicated to presenting an overall review on chip cooling using liquid metals or their alloys as coolant. Much more attention will be paid to the thermal properties of liquid metals with low melting points or their alloys and their potential applications in the chip cooling. Meanwhile, principles of several typical pumping methods such as mechanical, electromagnetic or peristaltic pumps will be illustrated. Some new advancement in making a liquid metal cooling device will be discussed. The liquid metal cooling is expected to open a new world for computer chip cooling because of its evident merits over traditional coolant.

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“…The room temperature liquid metal exhibits properties that are very different from solid metal due to its intrinsic fluid behaviour. Interest in this field has increased in a variety of areas such as electronics cooling [9,10], lab on a chip [11,12], flexible electronics [13], printed electronics [14,15], to name but a few. Recently, the motion or deformation characteristics of liquid metal in an electrolyte solution under various configurations have become a focal point of research with several discoveries reported [16][17][18][19][20].…”

Section: Introductionmentioning

confidence: 99%

Electromagnetic rotation of a liquid metal sphere or pool within a solution

Wang

Liu

2015

Proc. R. Soc. A.

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A liquid metal electric motor including a pair of concentric ring electrodes, permanent magnet and electrolyte solution is demonstrated. A liquid metal galinstan sphere, along with a NaOH solution, is stimulated to rotate centrifugally around the central electrode and the rotating speed increases with the voltage. The NaOH solution serves to rapidly remove the oxide on the liquid metal surface, reduce the motion friction and provide impetus to the liquid metal. As the mass of the liquid metal is increased to 12.16 g to form a kidney-like body, its rotating speed appears more controllable and the effect of the electrolytic action in the NaOH solution becomes weak in the range of 0-1.82 V. As the mass of the liquid metal is increased to 18.20 g to form a circular ringshaped body, the ideal voltage range for controlling the rotating motion of the liquid metal is 0-0.81 V. The metal fluid rotates at a speed of 1.9 r.p.m., even at an extremely low voltage of 0.03 V. The liquid metal electric motor established here can find important applications in chip cooling, liquid metal pumps, material mixing, soft machine realization, etc.

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Heat-driven liquid metal cooling device for the thermal management of a computer chip

Cited by 127 publications

References 21 publications

Recent progress on liquid metals and their applications

Recent progress on liquid metals and their applications

Liquid metal cooling in thermal management of computer chips

Electromagnetic rotation of a liquid metal sphere or pool within a solution

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