Heat Dissipation in Microelectronic Systems Using Phase Change Materials With Natural Convection

A numerical model for heat sinks with phase change materials and thermal conductivity enhancers

“…Comprehensive descriptions of experimental and computational assessment of PCM-based thermal management for different electronic systems are presented in [2][3][4][5][6][7]. Among the studies regarding enhancement of heat transfer through PCMs using TCEs, Tong et al [8] studied the possibility of heat transfer enhancement of a low thermal conductive PCM (water/ice system, in this case) by inserting an aluminum matrix.…”

An investigation of using a phase-change material to improve the heat transfer in a small electronic module for an airborne radar application

“…Phase-change materials (PCM's) have just recently been considered for temperature control of microelectronics [1,2] and, since the late 1960's, for thermal control in airborne electronic subsystems [3,4]. However, much research into heat transfer through a material undergoing a fusion phase change has been conducted since the late 1950's [5].…”

Finite element analysis of melting effects on MHD stagnation-point non-Newtonian flow and heat transfer from a stretching/shrinking sheet

“…Heat transfer accompanied with melting effects arises in many diverse areas of chemical and mechanical engineering. These include cooling of micro-electronic circuits [1] and binary mixture synthesis [2]. Numerous experimental and theoretical studies of melting thermal convection flows have been communicated.…”