2012
DOI: 10.1016/j.enconman.2011.09.020
|View full text |Cite
|
Sign up to set email alerts
|

Heat conduction analysis of multi-layered FGMs considering the finite heat wave speed

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1
1

Citation Types

0
11
0

Year Published

2013
2013
2022
2022

Publication Types

Select...
6
1

Relationship

0
7

Authors

Journals

citations
Cited by 31 publications
(11 citation statements)
references
References 17 publications
0
11
0
Order By: Relevance
“…to , DQM is applied. This method primarily proposed by Karami et al., is widely used in solving transport phenomena problems . Recently, Mofarahi et al .…”
Section: Problem Formulationmentioning
confidence: 99%
See 1 more Smart Citation
“…to , DQM is applied. This method primarily proposed by Karami et al., is widely used in solving transport phenomena problems . Recently, Mofarahi et al .…”
Section: Problem Formulationmentioning
confidence: 99%
“…This method primarily proposed by Karami et al, 59 is widely used in solving transport phenomena problems. 60,61 Recently, Mofarahi et al 62 applied this method to numerically simulate a nanofluid flow over a rotating disk. 62 They observed that compared with other numerical methods, for example, finite difference (FDM) and orthogonal collocation (OCM), DQM converges faster with fewer calculation points.…”
Section: Numerical Solutionmentioning
confidence: 99%
“…A new differential quadrature methodology for beam analysis has been described by Karami and colleagues . In this method no polynomial is needed for approximation of points and any number of points can easily be used with a zero to one root distribution such as a cosine distribution . These methods are compared to ensure that the numerical modeling is accurate, fast and doesn't depend on the techniques used, which may lead to false diffusion.…”
Section: Mathematical Modelmentioning
confidence: 99%
“…Graded materials are inhomogeneous materials, layered or continuous, which are increasingly used in technology, in such a way that the change of a material property with temperature may be compensated by its change with composition, in order to achieve optimization of some process [1][2][3][4][5][6][7][8]. A usual example is the alloy Si x Ge 1−x , which has been much studied in semiconductor physics to engineer heat or current transport [9][10][11][12][13].…”
Section: Introductionmentioning
confidence: 99%