2017 IEEE International Memory Workshop (IMW) 2017
DOI: 10.1109/imw.2017.7939084
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HBM (High Bandwidth Memory) DRAM Technology and Architecture

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Cited by 148 publications
(60 citation statements)
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“…HBM has a wider I/O bus compared to HMC to enhance the memory bandwidth. The bottom layer of HBM, called base logic die [25].…”
Section: B 3d-stacked Drammentioning
confidence: 99%
“…HBM has a wider I/O bus compared to HMC to enhance the memory bandwidth. The bottom layer of HBM, called base logic die [25].…”
Section: B 3d-stacked Drammentioning
confidence: 99%
“…HBM also has several DRAM layers, channels, banks and a logic layer, similar to HMC [16]. The major differences between HMC and HBM are the number of channels, banks and memory bus width.…”
Section: B 3d-stacked Drammentioning
confidence: 99%
“…Companies such as Micron and Samsung are dedicated to the exploration of 3D packaging technology. Products such as Hybrid Memory Cube (HMC) [8] and High Bandwidth Memory (HBM) [9,10] have already been released to markets. Three-dimensionally packaged memory provides a new approach to the memory system architecture.…”
Section: Introductionmentioning
confidence: 99%