Harsh Environment Materials

Singh, Thakur Gurjeet; Kohn, E.

doi:10.1016/b978-0-12-803581-8.09253-5

Cited by 6 publications

(4 citation statements)

References 218 publications

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“…To optimize the processes involved in LIGA techniques, the properties of the materials must be completely known, as they are strongly correlated to the parameters of the process. Furthermore, the properties of materials and surfaces must be tailored with respect to the mechanical and optical properties, thermal and electrochemical stability, and biocompatibility of the resulting devices [104]. Specifically, the substrate material employed for the LIGA process should be characterized by high resistance to dry, and wet etching, thermal stability, adhesion tendency to the substrate during electrodeposition, and insolubility of the unexposed resist during fabrication [103].…”

Section: Liga Techniquesmentioning

confidence: 99%

“…Specifically, it is possible to develop high precision and high aspect ratio (i.e., ratio between the height and the minimum lateral dimension) microstructures with flexible geometries and nanometer scale surface finishes (with a <50 nm surface roughness average value). Additionally, it allows for the use of a broad range of materials without introducing any thermal distortion and advanced scanner systems [81,102,[104][105][106]. However, several limitations must be considered, namely the radiation threat to the operator due to the use of high energy X-rays, the difficulties in managing the multistep process, and the high costs of the equipment [105].…”

Section: Liga Techniquesmentioning

confidence: 99%

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Microelectromechanical Systems (MEMS) for Biomedical Applications

Chircov

Grumezescu

2022

Micromachines

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The significant advancements within the electronics miniaturization field have shifted the scientific interest towards a new class of precision devices, namely microelectromechanical systems (MEMS). Specifically, MEMS refers to microscaled precision devices generally produced through micromachining techniques that combine mechanical and electrical components for fulfilling tasks normally carried out by macroscopic systems. Although their presence is found throughout all the aspects of daily life, recent years have witnessed countless research works involving the application of MEMS within the biomedical field, especially in drug synthesis and delivery, microsurgery, microtherapy, diagnostics and prevention, artificial organs, genome synthesis and sequencing, and cell manipulation and characterization. Their tremendous potential resides in the advantages offered by their reduced size, including ease of integration, lightweight, low power consumption, high resonance frequency, the possibility of integration with electrical or electronic circuits, reduced fabrication costs due to high mass production, and high accuracy, sensitivity, and throughput. In this context, this paper aims to provide an overview of MEMS technology by describing the main materials and fabrication techniques for manufacturing purposes and their most common biomedical applications, which have evolved in the past years.

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Section: Liga Techniquesmentioning

confidence: 99%

Section: Liga Techniquesmentioning

confidence: 99%

Microelectromechanical Systems (MEMS) for Biomedical Applications

Chircov

Grumezescu

2022

Micromachines

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“…High-κ dielectrics are commonly used for passivation layers in semiconductor devices [ 33 , 34 , 35 ] and solar cells [ 36 ]. Dielectrics are effective passivation materials as they are electrically and thermally insulating and can be easily scaled up for wafer-scale fabrication.…”

Section: Introductionmentioning

confidence: 99%

Application of Molecular Vapour Deposited Al2O3 for Graphene-Based Biosensor Passivation and Improvements in Graphene Device Homogeneity

et al. 2021

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Graphene-based point-of-care (PoC) and chemical sensors can be fabricated using photolithographic processes at wafer-scale. However, these approaches are known to leave polymer residues on the graphene surface, which are difficult to remove completely. In addition, graphene growth and transfer processes can introduce defects into the graphene layer. Both defects and resist contamination can affect the homogeneity of graphene-based PoC sensors, leading to inconsistent device performance and unreliable sensing. Sensor reliability is also affected by the harsh chemical environments used for chemical functionalisation of graphene PoC sensors, which can degrade parts of the sensor device. Therefore, a reliable, wafer-scale method of passivation, which isolates the graphene from the rest of the device, protecting the less robust device features from any aggressive chemicals, must be devised. This work covers the application of molecular vapour deposition technology to create a dielectric passivation film that protects graphene-based biosensing devices from harsh chemicals. We utilise a previously reported “healing effect” of Al2O3 on graphene to reduce photoresist residue from the graphene surface and reduce the prevalence of graphene defects to improve graphene device homogeneity. The improvement in device consistency allows for more reliable, homogeneous graphene devices, that can be fabricated at wafer-scale for sensing and biosensing applications.

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“…Future studies would provide the answer to this. More applications of SiC JFET in harsh, high temperature environment are expected in the future [1], [44], [68], however, according to [1] there is a need to research on the stability of the device in such environment, develop packages and other accessories that can stand such high temperature environment. For example, in a review of the development of 6H-SiC JFET by NASA for extreme temperature for application analog amplifier, digital logic gates ICs and amplifier circuits [12], reported the use of ceramic packages of Al 2 O 3 and gold metallization.…”

Section: Current Challenges and Areas For Futurementioning

confidence: 99%

Applications, Prospects and Challenges of Silicon Carbide Junction Field Effect Transistor (SIC JFET)

Ehiagwina

Kehinde

Afolabi

et al. 2016

IJATES

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Abstract-properties of Silicon Carbide Junction Field EffectTransistor (SiC JFET) such as high switching speed, low forward voltage drop and high temperature operation have attracted the interest of power electronic researchers and technologists, who for many years developed devices based on Silicon (Si). A number of power system Engineers have made efforts to develop more robust equipment including circuits or modules with higher power density. However, it was realized that several available power semiconductor devices were approaching theoretical limits offered by Si material with respect to capability to block high voltage, provide low on-state voltage drop and switch at high frequencies. This paper presents an overview of the current applications of SiC JFET in circuits such as inverters, rectifiers and amplifiers. Other areas of application reviewed include; usage of the SiC JFET in pulse signal circuits and boost converters. Efforts directed toward mitigating the observed increase in electromagnetic interference were also discussed. It also presented some areas for further research, such as having more applications of SiC JFET in harsh, high temperature environment. More work is needed with regards to SiC JFET drivers so as to ensure stable and reliable operation, and reduction in the prices of SiC JFETs through mass production by industries.

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Harsh Environment Materials

Cited by 6 publications

References 218 publications

Microelectromechanical Systems (MEMS) for Biomedical Applications

Microelectromechanical Systems (MEMS) for Biomedical Applications

Application of Molecular Vapour Deposited Al2O3 for Graphene-Based Biosensor Passivation and Improvements in Graphene Device Homogeneity

Applications, Prospects and Challenges of Silicon Carbide Junction Field Effect Transistor (SIC JFET)

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