Hardness and microstructural characteristics of rapidly solidified Al–8–16 wt.%Si alloys

Uzun, Orhan; Karaaslan, Tuncay; Göğebakan, Musa; Keskín, Mustafa

doi:10.1016/j.jallcom.2004.01.017

Cited by 108 publications

(57 citation statements)

References 31 publications

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“…It shows that, the Vickers hardness number of all alloys varies non-linearly with the applied load in the same manor. This type of non-linear behavior agrees with the results observed in [12][13][14][15] and known as the indentation size effect [16]. Figure 4 Micro-creep Figure 5 shows the variation of Hv versus indentation time.…”

Section: Resultssupporting

confidence: 84%

Effect of indium content and rapid solidification on microhardness and micro‐creep of Sn‐Zn eutectic lead free solder alloy

Shalaby¹

2010

Cryst. Res. Technol.

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The Sn-Zn alloys have been considered as lead-free solders. In this paper, the effect of 0.0, 0.5, 1.0, 1.5 and 2.0 wt.% Indium as ternary additions on melting temperature, structure, microhardness and micro-creep of the Sn-9Zn lead-free solders were investigated. It is shown that the alloying additions of Indium to the Sn-Zn binary system result in a suppression of the melting point to 187.9 °C. From x-ray diffraction analysis, a new intermetallic compound phase, designated β-In 3 Sn is detected. The formation of an intermetallic compound phase causes a pronounced increase in the electrical resistivity and mechanical strength. Also, an interesting connection between dynamic Young's modulus and the axial ratio (c/a) of the unit cell of the β-Sn was found in which Young's modulus increases with increasing the axial ratio (c/a). The ternary Sn-9Zn-xIn exhibits creep resistance superior to Sn-9Zn binary alloy. The better creep resistance of the ternary alloy is attributed to solid solution effect and precipitation of In 3 Sn in the Sn matrix. The addition of small amounts of In is found to refine the effective grain size and consequently, improves hardness. The 89%Sn-9%Zn-2%In alloy is a lead-free solder designed for possible drop-in replacement of Pb-Sn solders.

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Section: Resultssupporting

confidence: 84%

Effect of indium content and rapid solidification on microhardness and micro‐creep of Sn‐Zn eutectic lead free solder alloy

Shalaby¹

2010

Cryst. Res. Technol.

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“…There is a fast decrease of Vickers hardness number in the www.crt-journal.org © 2009 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim lower load range followed by a very slower decrease in the higher load ranges. This type of non-linear behavior agrees with the results observed in literature for several kinds of materials [17][18][19], and known as the indentation size effect [20]. Vickers hardness number of Sn-3.5Ag-xBi (x = 0, 1, 3, 5 and 10 %) alloys has been also calculated using three load systems of 0.098, 0.245 and 0.49 N and the results are illustrated in figure 6.…”

Section: Structuresupporting

confidence: 87%

Effect of Bi‐content on hardness and micro‐creep behavior of Sn‐3.5Ag rapidly solidified alloy

Kamal

Gouda

Marei

2009

Cryst. Res. Technol.

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In the present paper, the influence of 1, 3, 5 and 10 % Bi (weight %) as ternary additions on structure, melting and mechanical properties of rapidly solidified Sn-3.5Ag alloy has been investigated. The effect of Bi was discussed based on the experimental results. The experimental results showed that the alloys of Sn-3.5Ag, Sn-3.5Ag-1Bi and Sn-3.5Ag-3Bi are composed of two phases; Ag 3 Sn IMC embedded in Sn matrix phase, which indicated that the solubility of Bi phase in Sn-matrix was extended to 3 % as a result of rapid solidification. Bi precipitation in Sn matrix was only observed in Sn-3.5Ag-5Bi and Sn-3.5Ag-10Bi alloys. Also, addition of Bi decreased continuously the melting point of the eutectic Sn-3.5Ag alloy to 202.6 ºC at 10 % Bi. Vickers hardness of Sn-3.5Ag rapidly solidified alloy increased with increasing Bi content up to 3 % due to supersaturated solid solution strengthening hardening mechanism of Bi phase in Sn matrix, while the alloys contain 5 and 10 % Bi exhibited lower values of Vickers hardness. The lower values can be attributed to the precipitation of Bi as a secondary phase which may form strained regions due to the embrittlement of Bi atom. In addition, the effect of Bi addition on the micro-creep behavior of Sn-3.5Ag alloy as well as the creep rate have been described and has been calculated at room temperature.

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“…It was shown that very high CR significantly increases hardness [26]. By applying CR = 104 K/s in the solidification process, the hardness of hypereutectic alloy Al-16 wt.%Si increased from 601.6 ±60.6 to 1892.2 ±87.4.…”

Section: Hardnessmentioning

confidence: 99%

The Effect of Water Mist Cooling of Casting Die on the Solidification, Microstructure and Properties of AlSi20 Alloy

Władysiak¹,

Kozuń²,

Pacyniak³

2017

Archives of Metallurgy and Materials

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Unmodified AlSi20 alloy were casted at the research station, allowing for sequential multipoint cooling using a dedicated computer-controlled program. This method allows for the formation of the microstructure of hypereutectic AlSi20 alloy and also increases hardness. Primary silicon dendrites were found in the microstructure of cooled samples. Based on these dendrites, the formation of primary silicon particles is explained. Cooling of casting die with a water mist stream causes changes in solidification, which leads to expansion of the boundary layer with columnar crystals and shrinkage of the core zone with equiaxed crystals. It also causes more regular hardness distribution around pre-eutectic Si crystals, which can lead to tensile strength and machinability improvement.

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Hardness and microstructural characteristics of rapidly solidified Al–8–16 wt.%Si alloys

Cited by 108 publications

References 31 publications

Effect of indium content and rapid solidification on microhardness and micro‐creep of Sn‐Zn eutectic lead free solder alloy

Effect of indium content and rapid solidification on microhardness and micro‐creep of Sn‐Zn eutectic lead free solder alloy

Effect of Bi‐content on hardness and micro‐creep behavior of Sn‐3.5Ag rapidly solidified alloy

The Effect of Water Mist Cooling of Casting Die on the Solidification, Microstructure and Properties of AlSi20 Alloy

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