2013
DOI: 10.1016/j.enbuild.2012.11.009
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Gypsum based composite materials with micro-encapsulated PCM: Experimental correlations for thermal properties estimation on the basis of the composition

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Cited by 66 publications
(25 citation statements)
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“…MPCM was also added to sandwich panels [188] to increase their thermal inertia and to reduce the energy demand of the final buildings [186]. To manufacture the sandwich panel with microencapsulated PCM three different methods were tested.…”
Section: Mpcm Applicationsmentioning
confidence: 99%
“…MPCM was also added to sandwich panels [188] to increase their thermal inertia and to reduce the energy demand of the final buildings [186]. To manufacture the sandwich panel with microencapsulated PCM three different methods were tested.…”
Section: Mpcm Applicationsmentioning
confidence: 99%
“…It should be to point out that the PCM micro-encapsulation technology is increasingly used because of its ability to avoid leakage and to prevent forthright contact between the PCM and the building material. Although much researches have been conducted in recent years on such a topic [7][8][9][10][11], works on PCM incorporation in building bricks have been seldom addressed, yet widely used in mediterranean countries. Wherefore, this study aims to demonstrate the PCM integration concept in these typical constructions.…”
Section: Introductionmentioning
confidence: 99%
“…Since micro‐PCMs show excellent thermal energy storage properties, various approaches to micro‐PCM applications in building envelopes have been investigated . For instance, not only can they be mixed with concrete, but micro‐PCMs can also be incorporated with other materials, such as polyurethane foams or gypsum, to enhance the thermal insulation property of these wallboards . Biswas et al .…”
Section: Introductionmentioning
confidence: 99%
“…[27][28][29][30][31][32] For instance, not only can they be mixed with concrete, [27][28][29] but micro-PCMs can also be incorporated with other materials, such as polyurethane foams or gypsum, to enhance the thermal insulation property of these wallboards. 33,34 Biswas et al 35 prepared 1.3-cm-thick nano-PCM wallboard containing 20% by weight nano-PCM homogeneously dispersed in gypsum board. The nominal latent heats and the phase-change onset temperatures of melting were 26.9 J/g and 21.1 C, respectively.…”
Section: Introductionmentioning
confidence: 99%