Growth rate of intermetallic compounds in Al/Cu bimetal produced by cold roll welding process

Abbasi, Mehrdad; Taheri, Ali; Salehi, MohammadJavad

doi:10.1016/s0925-8388(01)00872-6

Cited by 384 publications

(206 citation statements)

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“…However, if the annealing time and/or temperature exceed a certain value, the development of interfacial structure leads to the formation of weak layers in the interfacial region and damage the bonds. [5][6][7][8] Al/Cu joint rapidly loses its mechanical integrity when the total width of intermetallic phases exceeds 1 um. However, some questions require further studies and the interfacial structure for misfit materials needs to be investigated in depth.…”

Section: Introductionmentioning

confidence: 99%

Effect of Annealing on the Interfacial Structure of Aluminum-Copper Joints

2007

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The aim of this study is to investigate the structure development and growth kinetics of the interfacial structure of cold roll bonded Al/Cu bimetal sheet. An interfacial structure is developed during the annealing process. The characteristics of the constituent phases at the interface of Al/Cu bimetal are studied by means of scanning electron microscope (SEM), X-ray diffraction (XRD) and transmission electron microscope (TEM). The results indicate that an obvious multi-layers interdiffusion structure is developed at the Al/Cu interface. The diffusion layer is consisted of four intermetallic compounds; Al 2 Cu, AlCu, Al 3 Cu 4 and Al 4 Cu 9 . The growth of these intermetallics during annealing can be achieved by the diffusion process. The activation energies of Al 2 Cu, AlCu + Al 3 Cu 4 , Al 4 Cu 9 and the total intermetallic layer are found to be 97.504, 107.46, 117.52 and 107.85 kJ/mol, respectively. These intermetallics generally possess higher hardness values than those of the corresponding base metals. AlCu and Al 3 Cu 4 exhibit much higher hardness than that of Al 2 Cu and Al 4 Cu 9 , which implies lower fracture toughness. The observation of crack propagation paths shows that fracture mainly occurs in the intermetallic compound layers of AlCu and Al 3 Cu 4 , which are located between Al 2 Cu and Al 4 Cu 9 .

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Section: Introductionmentioning

confidence: 99%

Effect of Annealing on the Interfacial Structure of Aluminum-Copper Joints

2007

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“…The microhardness variation was low in the HAZ regions of Cu. The microhardness profile also reveals sudden large peaks at the interface of the welds that are characteristic of the presence of intermetallics compounds typically formed during Al-Cu dissimilar welds [15]. Fig.…”

Section: Microhardness Variation Across the Weldmentioning

confidence: 86%

“…Joining of Al with Cu is difficult as their joining results in hard and brittle intermetallic compounds that reduce the joint strength, toughness and increase the electrical resistivity [15].…”

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confidence: 99%

Friction Stir Welds of Al Alloy-Cu: An Investigation on Effect of Plunge Depth

Wahid¹,

Siddiquee²,

Khan³

et al. 2016

Archive of Mechanical Engineering

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In the present study, butt joints of aluminum (Al) 8011-H18 and pure copper (Cu) were produced by friction stir welding (FSW) and the effect of plunge depth on surface morphology, microstructure and mechanical properties were investigated. The welds were produced by varying the plunge depth in a range from 0.1 mm to 0.25 mm. The defect-free joints were obtained when the Cu plate was fixed at the advancing side. It was found that less plunging depth gives better tensile properties compare to higher plunging depth because at higher plunging depth local thinning occurs at the welded region. Good tensile properties were achieved at plunge depth of 0.2 mm and the tensile strength was found to be higher than the strength of the Al (weaker of the two base metals). Microstructure study revealed that the metal close to copper side in the Nugget Zone (NZ) possessed lamellar alternating structure. However, mixed structure of Cu and Al existed in the aluminum side of NZ. Higher microhardness values were witnessed at the joint interfaces resulting from plastic deformation and the presence of intermetallics.

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“…However, time of this diffusion bonding must be controlled to avoid too thick intermetallic diffusion reactants affecting the bonding strength of aluminum -copper juncture interface. [6,7] Veerkamp [8] bonded aluminum -copper with copper electrode and the connection terminals for the aluminum bus system of high direct-current bus systems. Aluminum -copper bonding in the bus connecting terminal application is the very important key technology [9].…”

Section: Forewordmentioning

confidence: 99%