“…Pt, a costly and exceptionally active material, can be applied as a thin layer on more economical metal substrates, such as copper (Cu). − The activity of Pt can be adjusted through both structural and electronic effects for different applications such as the water gas shift reaction (WGSR) and electrochemical oxygen reduction reaction (ORR). , Extensive research has been conducted on the growth mechanism, thermal stability, and alloy formation behavior of Pt films deposited on Cu(111) surfaces. − ,,,,, Previous studies indicated that Pt films on Cu(111) grew in a layer-by-layer manner. ,, Upon annealing, these films have the potential to form surface alloys due to the intermixing of Pt and Cu. − , Theoretical studies suggest that the alloying process is driven by a combination of factors, including the difference in surface free energy between Pt and Cu, the negative mixing enthalpy between the two metals, and elastic strain relief. ,− It has been shown that Pt and Cu can intermix more easily through the step edges. , To investigate the effect of steps on surface alloying, Dastoor et al deposited Pt on Cu(111) and Cu(12 12 11) . Experimental evidence demonstrates that at room temperature, the amount of Pt concentrated in the second layer beneath the surface increases when the Cu substrate has a higher number of steps on its surface.…”