2013
DOI: 10.1016/j.electacta.2013.01.052
|View full text |Cite
|
Sign up to set email alerts
|

Growth of Pt by surface limited redox replacement of underpotentially deposited hydrogen

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

4
63
0
1

Year Published

2013
2013
2021
2021

Publication Types

Select...
6
1
1

Relationship

0
8

Authors

Journals

citations
Cited by 62 publications
(68 citation statements)
references
References 66 publications
4
63
0
1
Order By: Relevance
“…5 Several sacrificial materials, like Cu, 68 Pb,7,9 and H,10 have been studied for the deposition of Pt monolayers. In addition to Pt, the SLRR was extended to the monolayer deposition of other metals, such as Pd, 11 Ru, 12 and Ag.…”
mentioning
confidence: 99%
See 1 more Smart Citation
“…5 Several sacrificial materials, like Cu, 68 Pb,7,9 and H,10 have been studied for the deposition of Pt monolayers. In addition to Pt, the SLRR was extended to the monolayer deposition of other metals, such as Pd, 11 Ru, 12 and Ag.…”
mentioning
confidence: 99%
“…2,4 Brankovic et al developed a method for Pt monolayer deposition by galvanic displacement of a layer of sacrificial underpotential deposition (UPD) metal, which is called surface-limited redox replacement (SLRR). 5 Several sacrificial materials, like Cu, 68 Pb, 7,9 and H, 10 have been studied for the deposition of Pt monolayers. In addition to Pt, the SLRR was extended to the monolayer deposition of other metals, such as Pd, 11 Ru, 12 and Ag.…”
mentioning
confidence: 99%
“…In some cases, SLRR can be simplified by first performing UPD of the metal M, followed by injection of the metal N in the electrolyte, using a one-pot process [76]. SLRR has also been extended to the use of non-metallic sacrificial monolayers; for example, a UPD hydrogen layer has been used as a sacrificial layer to perform metal replacement [77]. Repetition of this process leads ideally to a homo-or hetero-epitaxial layer of high quality that could be used for particular functional applications.…”
Section: Surface-limited Electrochemical Processes For Materials Syntmentioning
confidence: 99%
“…Because of this, strategies such as surface limited redox replacement (SLRR), 6,[18][19][20][21][22][23][24][25][26][27][28][29][30] or limited ion adsorption on the substrate. [18][19][20][21][22][23][24][25][26]28,29,50,51 These factors ultimately result in the operation of a cyclic process that allows for the deposition of a strict amount of material (usually limited to a ML) per cycle rendering the deposit thickness finely controllable. An additional benefit of these methods is associated with the naturally existing short period of deposition inactivity between cycles that prevents the establishment steady mass transport controlled growth.…”
mentioning
confidence: 99%
“…16,17 Therefore, complete coverage of the substrate can be ensured, only by the deposition of films of significant thicknesses that, in turn, can be controlled solely by charge calculations over the course of deposition. Because of this, strategies such as surface limited redox replacement (SLRR), 6,[18][19][20][21][22][23][24][25][26][27][28][29][30] Defect-Mediated Growth (DMG), 31 Surfactant Mediated Growth (SMG), 32 Self-Terminating Growth (STG), 33,34 Forced Deposition (FD) 12,[35][36][37] and Spontaneous Deposition (SD) 11,[37][38][39][40][41][42][43][44][45][46][47][48][49] have * Electrochemical Society Student Member. * * Electrochemical Society Member.…”
mentioning
confidence: 99%