2017
DOI: 10.1039/c7ce01064h
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Growth mechanism of AlN on hexagonal BN/sapphire substrate by metal–organic chemical vapor deposition

Abstract: The growth mechanism and dislocation behavior of AlN on monolayer hBN materials without/with O2 plasma treatment by MOCVD.

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Cited by 34 publications
(37 citation statements)
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“…As seen in Figure S8, Mg 2+ is difficult to (de)intercalate into Li 4 Mn 5 O 12 cathode with the diameter range of 20–50 nm in APC electrolyte, unlike in “zero‐strain” Li 4 Ti 5 O 12 . In the light of previous work, the phenomenon can be explained as follows. On the one hand, the lattice constant of 8.1457 Å for Li 4 Mn 5 O 12 is less than that of 8.3595 Å for Li 4 Ti 5 O 12 .…”
Section: Resultsmentioning
confidence: 99%
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“…As seen in Figure S8, Mg 2+ is difficult to (de)intercalate into Li 4 Mn 5 O 12 cathode with the diameter range of 20–50 nm in APC electrolyte, unlike in “zero‐strain” Li 4 Ti 5 O 12 . In the light of previous work, the phenomenon can be explained as follows. On the one hand, the lattice constant of 8.1457 Å for Li 4 Mn 5 O 12 is less than that of 8.3595 Å for Li 4 Ti 5 O 12 .…”
Section: Resultsmentioning
confidence: 99%
“…Combining the advantages of Li + fast kinetics in the cathode and difficult formation of dendrites on Mg anode, a new approach for a hybrid Mg−Li battery with an Mg anode, a Li intercalation cathode and a hybrid Mg−Li electrolyte has been proposed . The working principle of a hybrid Mg−Li batteries is shown in Figure a.…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…[14,15] Notably, as a family member of III-nitrides, hexagonal BN (h-BN) owes better growth compatibility than other 2D materials for the epitaxy of III-nitride films and is thus believed to be the most suitable 2D material for III-nitrides epitaxy. [16,17] However, the integration between h-BN and conventional IIInitride film still remains a challenge due to the difficulty in combining different atomic hybridization. [18][19][20][21] In fact, it is very difficult to form covalent bonds on 2D materials due to the absence of dangling bonds.…”
Section: Doi: 101002/advs202000917mentioning
confidence: 99%
“…[ 5–9 ] In addition, the intermolecular dispersion interaction from graphene can largely relieve the stress between the substrate and the epilayer, leading to the epitaxy growth of strain‐relaxed III‐nitride materials. [ 10,11 ] Furthermore, it allows the transfer of epitaxial structures easily and eliminates the residual strain in the structures when they are released from the hetero‐substrates. [ 12–14 ] Till now, most efforts of III‐nitrides epitaxy are based on metal organic vapor phase epitaxy (MOVPE), where an AlN nucleation/buffer layer is necessary to guarantee the successful epitaxy of GaN.…”
Section: Introductionmentioning
confidence: 99%