Growth Mechanism of a Ternary (Cu,Ni)6Sn5 Compound at the Sn(Cu)/Ni(P) Interface

Huang, Teng‐Yi; Tseng, How; Lu, C. T.; Hsiao, Yu-Hsiang; Chuang, Y.C.; Liu, C. Y.

doi:10.1007/s11664-010-1339-5

Cited by 7 publications

(3 citation statements)

References 16 publications

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“…As a result, the (Cu, Ni) 6 Sn 5 grains was spalled and some (Cu, Ni) 6 Sn 5 grains were trapped into the solder. These results are consistent with previous studies [7,10,17]. Large silver 3 tin was also observed in the solder matrix of under water, air and furnace cooling.…”

Section: Intermetallic Morphology In Multiple Reflows: Cross Section supporting

confidence: 93%

“…Then, (Ni, Cu) 3 Sn 4 was changed to (Cu, Ni) 6 Sn 5 with rising copper concentration. These researchers also mentioned that, the copper concentration with 0.5 wt.% in the solder bump was one of the reasons for (Cu, Ni) 6 Sn 5 and (Ni, Cu) 3 Sn 4 intermetallic phase to appear on interfacial between solder and nickel-phosphorus [10]. This is consistent with Sn-4.0 Ag-0.5Cu used in this study.…”

Section: Intermetallic Morphology In Multiple Reflows: Top View Examisupporting

confidence: 82%

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The effect of cooling rate during multiple reflow soldering on intermetallic layer of Sn‐4.0 Ag‐0.5Cu/ENImAg

Adawiyah

Hafiz

Azlina

et al. 2019

Materialwissenschaft Werkst

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The effect of intermetallic compound layer between Sn‐4.0 Ag‐0.5Cu solder bump and electroless nickel/immersion silver (ENImAg) surface finish under different cooling rate during multiple reflow condition was investigated. The results show that the interfacial (Cu, Ni)6Sn5 intermetallic compound were formed at the early stage after the first reflow process. After multiple reflow processes, both (Cu, Ni)6Sn5 and (Ni, Cu)3Sn4 appeared as needle‐shaped at interface due to the amount of copper concentration into a solder balls. The spalling intermetallic compound of (Cu, Ni)6Sn5 was spotted in the solder which was caused by the formation of needle‐shaped from the gaps of (Cu, Ni)6Sn5. The intermetallic compound thickness and grain sizes became thicker and coarser with increasing reflow time, respectively. The results also perceived that the cooling rate condition can influence the growth of intermetallic compound formation. Faster cooling rate produced thinner intermetallic layer as well as smaller grain sizes compared to slow cooling rate. Hence, the cooling rate is a necessary parameter in the solder reflow process because it has an impact on the microstructure of morphology and intermetallic growth.

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Section: Intermetallic Morphology In Multiple Reflows: Cross Section supporting

confidence: 93%

Section: Intermetallic Morphology In Multiple Reflows: Top View Examisupporting

confidence: 82%

The effect of cooling rate during multiple reflow soldering on intermetallic layer of Sn‐4.0 Ag‐0.5Cu/ENImAg

Adawiyah

Hafiz

Azlina

et al. 2019

Materialwissenschaft Werkst

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show abstract

“…This formation can be explained by the earliest formation of binary Cu6Sn5 during reflow, followed by (Cu,Ni)6Sn5 after reflow process. It is due to the fact that the growth of (Cu,Ni)6Sn5 layer could be controlled by Cu diffusion in the Sn(Cu) toward the interface [12,13,14]. Moreover, (Cu,Ni)6Sn5 and (Ni,Cu)3Sn4 has been declared as stable compound than Cu6Sn5 which is due to addition of Ni layer on the Cu substrate [12].…”

Section: Top View Examinationmentioning

confidence: 99%

The Effect of Bismuth on Intermetallics Growth between Lead-Free Solders and Electroless Nickel Immersion Silver (ENIMAG) Surface Finish

Zolhafizi

Azlina

2019

KEM

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Surface finish is coating layer plated on a bare copper board of printed circuit board (PCB). Among PCB surface finishes, Electroless Nickel/Immersion Gold (ENIG) finish is a top choice among electronic packaging manufacturer due to its excellent properties for PCB. However, the use of gold element in ENIG is very high cost and the black pad issue have not been resolved. Thus, by introducing an Electroless Nickel/Immersion Silver (ENImAg) as alternative surface finish hopefully can reduce the cost and offer better properties. The aim of this study is to investigate the effect of bismuth on interfacial reaction during reflow soldering between Sn-2.5Ag (SA25), Sn-3.4Ag-4.8Bi (SAB3448) and ENIMAG surface finish. Solder balls with sizes of 500μm diameters were used. The characteristics of intermetallic compound (IMC) were analyzed by using scanning electron microscopy (SEM), optical microscope and energy dispersive x-ray (EDX). After reflow soldering, the result revealed that only the irregular circle-shape of (Cu,Ni)6Sn5IMC layer was formed at the interface and change to an irregular rod-like shape meanwhile the irregular needle-shape (Ni,Cu)3Sn4was appeared after aging treatment. The result also indicated that, the grain size and thickness of IMC for SAB3448 is smaller and thinner compared to the SA25. The IMC thickness is proportional to the aging duration and IMC morphology for both solder are became thicker, larger and coarser after isothermal aging. No bismuth particle has been detected on SAB3448 solder during top surface examination. In addition, the Bi has been observed can reduce the grain size and the growth rate of IMC. Keywords: ENIMAG, reflow soldering, lead-free solder, intermetallic compound, bismuth

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The influence of Pd on growth behavior of a quaternary (Cu,Ni,Pd)6Sn5 compound in Sn–3.0Ag–0.5Cu/Au/Pd/Ni–P solder joint during a liquid state reaction

Tseng

Duh

2012

J Mater Sci

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Growth Mechanism of a Ternary (Cu,Ni)6Sn5 Compound at the Sn(Cu)/Ni(P) Interface

Cited by 7 publications

References 16 publications

The effect of cooling rate during multiple reflow soldering on intermetallic layer of Sn‐4.0 Ag‐0.5Cu/ENImAg

The effect of cooling rate during multiple reflow soldering on intermetallic layer of Sn‐4.0 Ag‐0.5Cu/ENImAg

The Effect of Bismuth on Intermetallics Growth between Lead-Free Solders and Electroless Nickel Immersion Silver (ENIMAG) Surface Finish

The influence of Pd on growth behavior of a quaternary (Cu,Ni,Pd)6Sn5 compound in Sn–3.0Ag–0.5Cu/Au/Pd/Ni–P solder joint during a liquid state reaction

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