Growth characterization of intermetallic compounds at the Cu/Al solid state interface

Ma, Hui; Ren, Kexu; Xiao, Xiao; Qiu, Ranfeng; Shi, Hang

doi:10.1088/2053-1591/ab3171

Cited by 14 publications

(6 citation statements)

References 28 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…At higher reaction temperatures and time, it may disobey the parabolic law and obey the linear increase. The applicability of Equation (2) showed also good agreement for the Ti-Al case [14] (using D 0 = 21 × 10 −4 m 2 s −1 and Q = 296 kJ•mol −1 at 650 • C) and for the Cu-Al case [15][16][17] (using D 0 = 8.8 × 10 −4 m 2 s −1 and Q = 72 kJ•mol −1 at 650 • C). Note that the linear relationship can also be shown by taking the natural logarithm (ln) of both sides in Equations ( 1) and ( 2) and strongly depends on the temperature and the D 0 parameter.…”

Section: Introductionmentioning

confidence: 62%

A Review on Laser-Assisted Joining of Aluminium Alloys to Other Metals

Bunaziv

Akselsen

Ren

et al. 2021

Metals

View full text Add to dashboard Cite

Modern industry requires different advanced metallic alloys with specific properties since conventional steels cannot cover all requirements. Aluminium alloys are becoming more popular, due to their low weight, high corrosion resistance, and relatively high strength. They possess respectable electrical conductivity, and their application extends to the energy sector. There is a high demand in joining aluminium alloys with other metals, such as steels, copper, and titanium. The joining of two or more metals is challenging, due to formation of the intermetallic compound (IMC) layer with excessive brittleness. High differences in the thermophysical properties cause distortions, cracking, improper dilution, and numerous weld imperfections, having an adverse effect on strength. Laser beam as a high concentration energy source is an alternative welding method for highly conductive metals, with significant improvement in productivity, compared to conventional joining processes. It may provide lower heat input and reduce the thickness of the IMC layer. The laser beam can be combined with arc-forming hybrid processes for wider control over thermal cycle. Apart from the IMC layer thickness, there are many other factors that have a strong effect on the weld integrity; their optimisation and innovation is a key to successfully delivering high-quality joints.

show abstract

Section: Introductionmentioning

confidence: 62%

A Review on Laser-Assisted Joining of Aluminium Alloys to Other Metals

Bunaziv

Akselsen

Ren

et al. 2021

Metals

View full text Add to dashboard Cite

show abstract

“…In another study Al-Cu composite fabricated via conventional sintering also resulted in the development of Al 2 Cu intermetallic phase and were uniformly distributed using FSP [23]. Similarly, several studies have reported that the evolution of intermetallic phases significantly influenced enhancing the mechanical and electrical properties in the Al-Cu system [39][40][41][42][43][44][45][46][47].…”

Section: Friction Stir Processingmentioning

confidence: 85%

Energy-efficient method for developing in-situ Al-Cu metal matrix composites using microwave sintering and friction stir processing

Malik

Bajakke

Saxena

et al. 2022

Mater. Res. Express

View full text Add to dashboard Cite

The problems associated with the fabrication of in-situ metal matrix composites (MMC) by conventional methods can be avoided by using microwave sintering and friction stirring in combination. The current study investigates the mechanical and electrical properties of pure aluminum (Al-100 wt.%) and Al-Cu MMC. The results showed that excellent ultimate tensile strength, toughness, and electrical conductivity can be acquired simultaneously. The obtained ultimate tensile strength in the case of Al-100wt.% (184.5 MPa) has improved two-fold than that of a typical commercially pure aluminum AA1016 (90 MPa). Similarly, the electrical conductivity of developed pure aluminum (88.87% IACS) is 1.4 times higher compared to AA1016 alloy (62% IACS). For Al-Cu MMC the copper is added in steps of 5 wt.% (5%, 10%, 15%, and 20%). The maximum ultimate tensile strength (205.2 MPa) and the electrical conductivity (71.53% IACS) obtained for Al-10wt.%Cu are higher compared to the AA1016 alloy. The present investigation suggests a novel processing route and opens up new research avenues in the field of solid-state materials processing.

show abstract

“…Initially, the CuAl 2 phase is observed at the interface between aluminum and copper as the maximum solid solubility of Cu in Al is 2.48 at%, whereas that of Al in Cu is 19.7 at%. Hence, Al atoms diffuse into the copper readily, leaving vacancies on the aluminum side, and the Cu-rich atoms, which have lower diffusivity, occupy these vacancies created on the Al side. − …”

Section: Resultsmentioning

confidence: 99%

Impact of Bonding Temperature on Microstructure, Mechanical, and Fracture Behaviors of TLP Bonded Joints of Al2219 with a Cu Interlayer

Vatnalmath,

Auradi,

et al. 2023

ACS Omega

View full text Add to dashboard Cite

The present study aims at producing transient liquid phase (TLP) bonded Al2219 joints with pure Cu (copper) as an interlayer. The TLP bonding is carried out at the bonding temperatures in the range of 480 to 520 °C while keeping the bonding pressure (2 MPa) and time (30 min.) constant. Reaction layers are formed at the Al-Cu interface with a significant increase in diffusion depth with the increase in the bonding temperature. The microstructural investigations are carried out using scanning electron microscopy and energy-dispersive spectroscopy. X-ray diffraction study confirms the formation of CuAl2, CuAl, and Cu9Al4 intermetallic compounds across the interface of the bonded specimens. An increase in microhardness is observed across the bonding zone with the increase in the bonding temperature, and a maximum hardness value of 723 Hv is obtained on the diffusion zone of the specimen bonded at 520 °C. Furthermore, the fractography study of the bonded specimens is carried out, and a maximum shear strength of 18.75 MPa is observed on the joints produced at 520 °C.

show abstract

Growth characterization of intermetallic compounds at the Cu/Al solid state interface

Cited by 14 publications

References 28 publications

A Review on Laser-Assisted Joining of Aluminium Alloys to Other Metals

A Review on Laser-Assisted Joining of Aluminium Alloys to Other Metals

Energy-efficient method for developing in-situ Al-Cu metal matrix composites using microwave sintering and friction stir processing

Impact of Bonding Temperature on Microstructure, Mechanical, and Fracture Behaviors of TLP Bonded Joints of Al2219 with a Cu Interlayer

Contact Info

Product

Resources

About