Growth behavior of small surface cracks in coarse and ultrafine grained copper

Goto, Masahiro; Han, Sen; Ando, Yoshinori; Kawagoishi, Norio; Teshima, Norihiro; Kim, S. S.

doi:10.2495/cmem090451

Cited by 2 publications

(2 citation statements)

References 22 publications

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“…Accordingly, the shorter fatigue life of UFG12 at medium and low stress amplitudes resulted from diminished crack initiation life because of accelerated slip band formation caused by early formation of large recrystallized grains. It has been shown that the difference in pass number in UFG copper has a negligible effect on the crack growth rate [15]. Here, one should be aware that the occurrence of the dynamically recovered grains in UFG4 never imply no generation of dynamically recrystallized grains.…”

Section: Resultsmentioning

confidence: 90%

Fatigue-induced grain growth and formation of slip bands in Cu processed by equal channel angular pressing

Goto¹,

Baba²,

Han³

et al. 2015

Computational Methods and Experimental Measurements XVII

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In order to elucidate the effect of the microstructure on fatigue behavior of ultrafine grained copper, fatigue tests were conducted using copper processed by equal channel angular pressing through 4, 8 and 12 pass numbers. The evolution of microstructure and surface damage during cyclic stressing was monitored. For samples processed by 8 and 12 passes, dynamically recrystallized grains were formed and these grew with subsequent stressing. Slip bands were initiated inside such grains. For samples processed by 4 passes, the formation of slip bands was likely to occur inside dynamically recovered coarse grains. The physical basis on the phenomena leading to the initiation of fatigue cracks was discussed from the viewpoint of microstructure and surface damage evolution.

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Section: Resultsmentioning

confidence: 90%

Fatigue-induced grain growth and formation of slip bands in Cu processed by equal channel angular pressing

Goto¹,

Baba²,

Han³

et al. 2015

Computational Methods and Experimental Measurements XVII

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“…(2) for determining the growth rate of small cracks at high stress amplitudes: (2) where D and n are material constants. The growth data of small cracks in various metals indicated that dl/dN of a mechanically small crack is uniquely determined by the term  a n l and not by ΔK [6,9,10]. Fig.…”

Section: Figure 11mentioning

confidence: 99%

High-cycle fatigue characteristics of squeezed cast aluminum alloy smooth specimens cut from car wheels

Goto¹,

Teshima²,

Han³

et al. 2012

WIT Transactions on the Built Environment

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High-cycle fatigue tests of smooth specimens cut from squeeze cast Al alloy car wheels were carried out to clarify the fatigue behaviour under constant stress amplitudes. In addition to this, fatigue tests under two-step stressing were performed to study the effect of stress change on fatigue damage. Fatigue cracks were initiated from eutectic Si particles and sometimes from a slip band in the matrix. But, no cracks were initiated from microscopic defects like pin-holes and shrinkage porosities. The lnl vs. N/N f relation (l: crack length, N f : number of cycles to failure) under constant stress amplitudes exhibited stress dependency, namely the crack length initiated at a given value of N/N f was larger in higher stresses. With regard to the fatigue damage under two-step stressing, the cumulative cycle ratio, (N/N f ), for low-to-high block stressing was smaller than 1, however it was larger than 1 for high-to-low block stressing. The value of (N/N f )) was closely related to the growth characteristics of a small crack.

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Growth behavior of small surface cracks in coarse and ultrafine grained copper

Cited by 2 publications

References 22 publications

Fatigue-induced grain growth and formation of slip bands in Cu processed by equal channel angular pressing

Fatigue-induced grain growth and formation of slip bands in Cu processed by equal channel angular pressing

High-cycle fatigue characteristics of squeezed cast aluminum alloy smooth specimens cut from car wheels

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