Growth behavior of intermetallic layers at the interface between Cu and eutectic Sn–Bi by grain boundary diffusion with the grain growth at solid-state temperatures

Minho, O; Tanaka, Yūki; Kobayashi, Equo

doi:10.1016/j.intermet.2023.107986

Cited by 9 publications

(1 citation statement)

References 43 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Cross-sections of the annealed diffusion couples were meticulously prepared by mechanical polishing using #1500-4000 emery papers and alumina particles measuring 0.05 µm in diameter. Final surface finishing was accomplished using colloidal silica [22,23]. The microstructure of these cross-sections was examined using a differential interference contrast optical microscope (DICOM).…”

Section: Observation and Identification Of Phases At The Interfacementioning

confidence: 99%

Microstructural Transformations in Solid-State Annealed Al/Ag/Al Diffusion Couples Examined via High-Voltage Electron Microscopy (HVEM)

Oh,

Kajihara

2023

Metals

Self Cite

View full text Add to dashboard Cite

This study focuses on the practical relevance of the Al-Ag bonding interface in electronic device fabrication, particularly in wire bonding, which is crucial for enhancing component reliability and performance. Experiments involved Al/Ag/Al diffusion couples, annealed at 703 K, revealing two stable intermediate phases, μ and δ. Characterizing the intermediate phases’ compositions and concentration profiles exposed a vital transition at the δ-Al interface. We used high-voltage electron microscopy (HVEM) to examine crystal structure evolution, identifying a (hexagonal close-packed) hcp structure in the intermediate phase between δ and Al, matching the δ phase. Notably, a substantial microstructural transformation occurred within the Ag-Al diffusion couple, as nano-sized precipitates transitioned from spherical to plate-like, along specific {111} planes, reflecting the evolution from off-stoichiometric, disordered phases to ordered ones. Mapping the concentrations of intermediate phases on the Al-Ag phase diagram revealed shifted and narrower solubility ranges compared to the calculations. This study provides insight into the crystal structure and microstructure changes during diffusion in Al/Ag/Al diffusion couples, holding implications for electronic device fabrication. Understanding intermediate phase behavior and evolution is vital in this context, potentially influencing materials development and process optimization in the electronic components industry, and thus, enhancing device performance and reliability.

show abstract

Section: Observation and Identification Of Phases At The Interfacementioning

confidence: 99%

Microstructural Transformations in Solid-State Annealed Al/Ag/Al Diffusion Couples Examined via High-Voltage Electron Microscopy (HVEM)

Oh,

Kajihara

2023

Metals

Self Cite

View full text Add to dashboard Cite

show abstract

Role of Cu microstructure during isothermal aging of Cu/Sn/Cu micro solder joints

Wei,

Zhang,

Shi

et al. 2024

J Mater Sci

View full text Add to dashboard Cite

Growth behavior and kinetics of interfacial IMC for ZnSnCuNiAl/Cu solder joints subjected to isothermal aging

Chen,

Hu,

Tang

2024

J Mater Sci: Mater Electron

View full text Add to dashboard Cite

Growth behavior of intermetallic layers at the interface between Cu and eutectic Sn–Bi by grain boundary diffusion with the grain growth at solid-state temperatures

Cited by 9 publications

References 43 publications

Microstructural Transformations in Solid-State Annealed Al/Ag/Al Diffusion Couples Examined via High-Voltage Electron Microscopy (HVEM)

Microstructural Transformations in Solid-State Annealed Al/Ag/Al Diffusion Couples Examined via High-Voltage Electron Microscopy (HVEM)

Role of Cu microstructure during isothermal aging of Cu/Sn/Cu micro solder joints

Growth behavior and kinetics of interfacial IMC for ZnSnCuNiAl/Cu solder joints subjected to isothermal aging

Contact Info

Product

Resources

About