Growth Behavior of Interfacial Intermetallic Compounds of Co-20%P/Solder Joint under Temperature Gradient

Qin, Haotong; Yang, Di; Fan, Tao; Chen, Tao; Zhang, Chunhong; Chen, YuQian

doi:10.1109/icept52650.2021.9568134

2021 22nd International Conference on Electronic Packaging Technology (ICEPT) 2021

DOI: 10.1109/icept52650.2021.9568134

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Growth Behavior of Interfacial Intermetallic Compounds of Co-20%P/Solder Joint under Temperature Gradient

Haotong Qin

Di Yang

Tao Fan

et al.

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Growth Behavior of Interfacial Intermetallic Compounds of Co-20%P/Solder Joint under Temperature Gradient

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