Abstract:Two approaches have been compared for the low temperature epitaxy of thick, partially relaxed GeSn layers on top of Ge strain relaxed buffers. The benefit of using step-graded instead of constant composition layers when targeting really high Sn contents (16%, here) was conclusively demonstrated. Digermane (Ge 2 H 6 ) and tin-tetrachloride (SnCl 4 ) were used as Ge and Sn precursors, respectively. The growth pressure (100 Torr) and the F(Ge 2 H 6 )/F(SnCl 4 ) mass-flow ratio being constant, it was through a tem… Show more
“…This suggests that epilayers are in fact formed of two distinct layers with different concentration. The situation was confirmed by TEM‐EDX analysis confirmed the presence of layers with two distinct Sn concentrations, a thin lower concentration layer accommodating the plastic strain relaxation between the Ge substrate and the thick high‐Sn layer . With such configuration, we assume that only the highest Sn‐concentrated layer will contribute to the emission as the layer presents the smallest bandgap of the whole stack.…”
Section: Gesn Samples Elaborationmentioning
confidence: 61%
“…The Ge x Sn (1− x ) energy bandgap at the Γ point ( is determined by fitting temperature‐dependent PL measurements of the stack described in ref. [] shown in the inset of Figure . Using Equation and bandgap energy calculated for Ge, we are able to plot temperature‐dependent as shown in Figure .…”
From temperature-dependent photoluminescence of a single Ge 0.84 Sn 0.16 sample, Sn-related Varshni parameters are extracted and used as input parameters in an 8-band k·p model, and predict direct bandgap energies of high Sn content GeSn alloys with concentration varying from 8% to 16%. Then, exhaustively compared are the calculated direct -valley bandgap energies to photoluminescence results of 13% and 16% Sn content alloys and to direct bandgap energies found in literature. The agreement between k·p modeling and experimental datasets is close to 3% for different strain conditions of GeSn epilayers. The outcome of this study is an 8-band k·p model with a fixed set of parameters, the model being self-sufficient to describe the direct bandgap of Ge 1−x Sn x layers with x varying from 8% to 16% for large ranges of strain and temperature.
“…This suggests that epilayers are in fact formed of two distinct layers with different concentration. The situation was confirmed by TEM‐EDX analysis confirmed the presence of layers with two distinct Sn concentrations, a thin lower concentration layer accommodating the plastic strain relaxation between the Ge substrate and the thick high‐Sn layer . With such configuration, we assume that only the highest Sn‐concentrated layer will contribute to the emission as the layer presents the smallest bandgap of the whole stack.…”
Section: Gesn Samples Elaborationmentioning
confidence: 61%
“…The Ge x Sn (1− x ) energy bandgap at the Γ point ( is determined by fitting temperature‐dependent PL measurements of the stack described in ref. [] shown in the inset of Figure . Using Equation and bandgap energy calculated for Ge, we are able to plot temperature‐dependent as shown in Figure .…”
From temperature-dependent photoluminescence of a single Ge 0.84 Sn 0.16 sample, Sn-related Varshni parameters are extracted and used as input parameters in an 8-band k·p model, and predict direct bandgap energies of high Sn content GeSn alloys with concentration varying from 8% to 16%. Then, exhaustively compared are the calculated direct -valley bandgap energies to photoluminescence results of 13% and 16% Sn content alloys and to direct bandgap energies found in literature. The agreement between k·p modeling and experimental datasets is close to 3% for different strain conditions of GeSn epilayers. The outcome of this study is an 8-band k·p model with a fixed set of parameters, the model being self-sufficient to describe the direct bandgap of Ge 1−x Sn x layers with x varying from 8% to 16% for large ranges of strain and temperature.
“…The Ge buffer layer is almost relaxed, with a nominal thickness of 700 nm (residual strain of ∼−0.1%). A multiple-step Sn-enhanced growth recipe was used, which was developed and reported in our previous study on the spontaneous-relaxation-enhanced (SRE) Sn incorporation process: the gradual relaxation of the material facilitates Sn incorporation [17,27], resulting in an increased Sn composition along the growth direction. Two samples (denoted by A and B) with Sn compositions as high as ∼20.0% were grown.…”
Section: Materials Growth and Characterizationmentioning
A silicon-based monolithic laser has long been desired. Recent demonstration of lasing from direct bandgap group-IV alloy GeSn has opened up a completely new approach that is different from the traditional III-V integration on Si. In this study, high-quality GeSn samples were grown using a unique spontaneous Sn-enhanced growth recipe with an Sn composition as high as ∼20.0%. GeSn lasers based on waveguide Fabry-Pérot and micro-disk cavities were fabricated and characterized. The waveguide features better local heat dissipation, while the micro-disk offers stronger optical confinement plus strain relaxation. The maximum operating temperature of 260 K was achieved from a waveguide laser, and a threshold of 108 kW/cm 2 at 15 K was achieved from a micro-disk laser. A peak lasing wavelength of up to 3.5 µm was obtained with a 100-µm-wide ridge waveguide laser.
“…GeSn layers were grown on top of a 2.5 µm thick Ge strain relaxed buffer (SRB), which was itself deposited on top of a Si (001) substrate. Ge 2 H 6 and SnCl 4 fluxes were fixed and the temperature gradually lowered -from 349°C down to 313°Cduring the growth at 100 Torr to create discrete Sn concentration steps, known as "GeSn stepgraded epitaxy" in [16,19,20]. Such a strategy limits the number of threading dislocations propagating towards the optically active GeSn 16.0% layer and relaxes it partially.…”
Section: Epitaxy and Fabrication Methodsmentioning
We demonstrate lasing up to 230 K in a GeSn heterostructure micro-disk cavity. The GeSn 16.0% optically active layer was grown on a step-graded GeSn buffer, limiting the density of misfit dislocations. The lasing wavelengths shifted from 2720 to 2890 nm at 15 K up to 3200 nm at 230 K. Compared to results reported elsewhere, we attribute the increase in maximal lasing temperature to two factors: a stronger optical confinement by a thicker active layer and a better carrier confinement provided by a GeSn 13.8% / GeSn 16.0% / GeSn 13.8% double heterostructure.
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