Growth and properties of intermetallics formed during thermal aging of Cu-Al ball bonds

Gubbels, Ghm; Kouters, M.H.M.; O'Halloran, Orla; Rongen, R.T.H.

doi:10.1109/estc.2010.5642821

Cited by 11 publications

(6 citation statements)

References 2 publications

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“…The UNAT trajectory line-scan in Figure 6 shows that the intermetallic layers have significantly higher hardnesses and indentation Young's moduli than the Cu and Al solid solution regions. Due to the relatively fast rate of diffusion of Cu-atoms into the AI-lattice there is an extensive region (> 30 micron) of solid solution of Al (�2at %) in Cu [7,10]. Hardness and indentation Young's moduli for the CU9AI4 and CUJAb phases are almost similar; in addition, no clear layer boundary was observed, either in light or scanning electron microscope.…”

Section: Indentation Young's Modulusmentioning

confidence: 98%

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Characterization of intermetallic compounds in Cu-Al ball bonds: Mechanical properties, delamination strength and thermal conductivity

Kouters¹,

Gubbels²,

Yuan³

2012

2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

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In high power automotive electronics copper wire bonding is regarded as most promising alternative for gold wire bonding in 1" level interconnects and therefore subjected to severe functional requirements. In the Cu-Al ball bond interface the growth of intermetallic compounds may deteriorate the electrical, thermal and mechanical properties. The layer growth and properties of these intermetallic compounds are crucial in the prediction of the long term behavior. To mimic the growth of inter metallic compounds during and aft er copper ball bonding, diffusion couples of aluminium and copper were annealed at 22S-S00°C and chemically analyzed by SEMIEDS. Also five separate intermetallic compounds were melted together from the pure elements and aged in evacuated quartz ampoules for 240 hours at SOo°c. In this work values for the indentation Young's modulus, load independent hardness, indentation fracture toughness, volumetric densities, interface delamination and thermal conductivity are presented. It can be concluded that the Cu-rich intermetallics CU9Al4 and CU3Al2 are less sensitive to fracture and have lower average densities than the other intermetallic compounds. The volumetric decrease during formation causes internal stress. Interfacial delamination initiates in the AI-rich intermetallics (CuAI, CuAI2) and propagates easily into other intermetallic layers. The CU9Al4 -Cu S.s. is also found to be susceptible for delamination fracture. The thermal conductivity is much lower than for pure copper or aluminium and in the range of 26-87 Wlm-i *Ki, where Cu�12 layer has the lowest thermal conductivity (26-33 Wlm-i*Ki).

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Section: Indentation Young's Modulusmentioning

confidence: 98%

“…In our previous work the identification and layer growth rates were determined [7,8] and compared with data published by Funamizu [9]. The detection of thin intermetallic layers is cumbersome; at lower temperature regimes intermetallic phases are not present in measurable amounts.…”

Section: Introductionmentioning

confidence: 99%

Characterization of intermetallic compounds in Cu-Al ball bonds: Mechanical properties, delamination strength and thermal conductivity

Kouters¹,

Gubbels²,

Yuan³

2012

2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

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“…3). Известно, что упрочнение в таких композитах может быть связанно с действием комплекса механизмов, таких как: 1) зернограничное упрочнение, за счет модификации структуры и уменьшения среднего размера зерна; 2) упрочнения за счет препятствия движению дислокаций дисперсными включениями второй фазы; 3) твер- [44,45]; f Al , 4 9…”

Section: структура и механические свойства композитов после холодногоunclassified

Phase Transformations during Mechanical Alloying of Powders with Eutectic Composition of Al–Cu and Al–Cu/C Systems and Their Effect on the Structure and Mechanical Properties of the Composites

Matvienko¹,

Rud²,

Поліщук³

et al. 2019

Metallofiz. Noveishie Tekhnol.

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“…In our previous work the identification and layer growth rates were determined [7] and compared with data published by Funamizu [8]. The detection of thin intermetallic layers is cumbersome; at lower temperature regimes intermetallic phases are not present in measurable amounts.…”

Section: Introductionmentioning

confidence: 99%

Characterization of intermetallic compounds in Cu-Al ball bonds: Thermo-mechanical properties, interface delamination and corrosion

Gubbels¹,

Kouters²,

Ferreira

2012

2012 4th Electronic System-Integration Technology Conference

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In high power automotive electronics copper wire bonding is regarded as the most promising alternative for gold wire bonding in 1 st level interconnects. In the Cu-Al ball bond interface the growth of intermetallic compounds can deteriorate the electrical and mechanical properties of the interconnection. A summary of the thermo-mechanical properties of Cu-Al intermetallic compounds is given. Delamination experiments were performed to study interfacial cracking in the Cu-Al system. Interfacial delamination initiates in the Al-rich intermetallics (CuAl, CuAl 2 ) and propagates easily into other intermetallic layers. The Cu 9 Al 4 -Cu s.s. is also found to be susceptible for delamination fracture. To quantify the corrosion and oxidation sensitivity of Cu-Al intermetallics 8 different aging experiments under various conditions ( t, T, air or halogen-rich solution or combined) were performed. In all cases the oxidation/corrosion attack at the non-equilibrium Cu s.s. -interface with the Cu-Al intermetallics is more severe than of a homogeneous bulk solid solution of aluminum in copper (with more than 5 wt% Al). The oxidation/corrosion attack is even more severe than for pure copper.

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Growth and properties of intermetallics formed during thermal aging of Cu-Al ball bonds

Cited by 11 publications

References 2 publications

Characterization of intermetallic compounds in Cu-Al ball bonds: Mechanical properties, delamination strength and thermal conductivity

Characterization of intermetallic compounds in Cu-Al ball bonds: Mechanical properties, delamination strength and thermal conductivity

Phase Transformations during Mechanical Alloying of Powders with Eutectic Composition of Al–Cu and Al–Cu/C Systems and Their Effect on the Structure and Mechanical Properties of the Composites

Characterization of intermetallic compounds in Cu-Al ball bonds: Thermo-mechanical properties, interface delamination and corrosion

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