“…Current methods for producing polymeric thin films include the deposition and polymerization of Langmuir−Blodgett (LB) films, ,− self-assembled monolayers (SAMs), − and reactive monomers adsorbed directly on metal single crystal surfaces. − However, for most systems studied, little is known about the reaction mechanisms leading to polymerization, the thermal decomposition reactions of the polymers formed, or the role of the substrate in these processes. For example, bulk polyimide made from pyromellitic dianhydride (PMDA) and oxydianiline (ODA) is stable at temperatures up to 500 °C. , However, polyimide films made from reactive adsorption of PMDA and ODA on Cu(110) decompose at ∼280 °C. , The thermal stability of the film is believed to be limited by the reactivity of the carboxylate endgroups bound to the surface, but the decomposition pathway and the influence of the substrate on the endgroup stability have not been thoroughly studied. Ultimately, elucidating the polymerization initiation, propagation, and termination mechanisms in addition to correlating the role of the surface on both formation and decomposition may enable the design of high-quality crystalline polymeric thin films whose stability rivals that seen in the bulk.…”