2001 IEEE EMC International Symposium. Symposium Record. International Symposium on Electromagnetic Compatibility (Cat. No.01CH
DOI: 10.1109/isemc.2001.950507
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Grounding of heatpipe/heatspreader and heatsink structures for EMI mitigation

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Cited by 10 publications
(2 citation statements)
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“…11 is the measured CM inductance on a Agilent 4294A precision impedance analyzer. It can be seen that the measured CM inductance is about 189 µH which is quite close to the required value of inductance calculated in (12).…”
Section: Determination and Implementation Of CM Inductorsupporting
confidence: 81%
See 1 more Smart Citation
“…11 is the measured CM inductance on a Agilent 4294A precision impedance analyzer. It can be seen that the measured CM inductance is about 189 µH which is quite close to the required value of inductance calculated in (12).…”
Section: Determination and Implementation Of CM Inductorsupporting
confidence: 81%
“…Attention has been focused on another CM noise source, i.e. the parasitic capacitance between heat sink and the ground/chassis of the power converter [1,12]. To mitigate this CM noise source, heat sinks are connected to power supply return instead of ground.…”
Section: Introductionmentioning
confidence: 99%