Ground connection soldering techniques of high density ceramics substrate of transmit/receive module and its reliability

Tingyue, Wang; Dianheng, Cui; Shenlin, Yu; Tanida, Jun; Wei, Yan

doi:10.1109/iemt.1997.626928

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium

DOI: 10.1109/iemt.1997.626928

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Ground connection soldering techniques of high density ceramics substrate of transmit/receive module and its reliability

Wang Tingyue

Cui Dianheng²,

Yu Shenlin³

et al.

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Ground connection soldering techniques of high density ceramics substrate of transmit/receive module and its reliability

Cited by 1 publication

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Advanced interconnecting techniques of integrated T/R modules

Advanced interconnecting techniques of integrated T/R modules

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