Grinding-and-Slicing Technique as an Advanced Technology for Silicon Wafer Slicing

Tönshoff, Hans Kurt; Karpuschewski, Bernhard; Hartmann, Matthias; Spengler, Carsten

doi:10.1080/10940349708945636

Cited by 26 publications

(9 citation statements)

References 5 publications

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“…The traditional taper polishing is one of the widely used methods for subsurface damage detection and observations [1,2,[19][20][21][22][23][24][25][26]. Figure 2 shows the schematics of the taper polishing method.…”

Section: Traditional Taper Polishingmentioning

confidence: 99%

Methods for Detection of Subsurface Damage: A Review

Yin

Bai

2018

Chin. J. Mech. Eng.

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Subsurface damage is easily induced in machining of hard and brittle materials because of their particular mechanical and physical properties. It is detrimental to the strength, performance and lifetime of a machined part. To manufacture a high quality part, it is necessary to detect and remove the machining induced subsurface damage by the subsequent processes. However, subsurface damage is often covered with a smearing layer generated in a machining process, it is rather difficult to directly observe and detect by optical microscopy. An efficient detection of subsurface damage directly leads to quality improvement and time saving for machining of hard and brittle materials. This paper presents a review of the methods for detection of subsurface damage, both destructive and non-destructive. Although more reliable, destructive methods are typically time-consuming and confined to local damage information. Non-destructive methods usually suffer from uncertainty factors, but may provide global information on subsurface damage distribution. These methods are promising because they can provide a capacity of rapid scan and detection of subsurface damage in spatial distribution.

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Section: Traditional Taper Polishingmentioning

confidence: 99%

Methods for Detection of Subsurface Damage: A Review

Yin

Bai

2018

Chin. J. Mech. Eng.

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“…The damage in the Si wafers caused by mechanical grinding has been also investigated by many other research groups (see, for example, Ref. [9][10][11][12]). Therefore, finishing steps will be required to achieve a surface with exceptional flatness and mirror-like finish and to remove the structurally damaged layer and the residual stresses left after the mechanical grinding step.…”

Section: Wafer Thinningmentioning

confidence: 99%

Laser-assisted ultrathin die packaging: Insights from a process study

Marinov

Swenson

Atanasov

et al. 2013

Microelectronic Engineering

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“…Many techniques have been reported to observe/measure SSD in silicon wafers: angle polishing (Abe et al, 1994;Tonshoff et al, 1997), angle lapping (Jeong et al, 2000;Oh et al, 1999), step polishing (Stephens, 1986), step etching plus scanning infrared depolarisation (Lundt et al, 1994), cross-sectional microscopy (Abe et al, 1994;Kang et al, 2005;Mchedlidze et al, 1995;Pei et al, 1999;Zarudi and Zhang, 1996) and etching method (Tonshoff et al, 1990). However, these techniques either destroy the wafers or measure only localised areas instead of the whole wafer.…”

Section: Introductionmentioning

confidence: 99%

Non-destructive evaluation methods for subsurface damage in silicon wafers: a literature review

Lu¹,

Pei²,

Sun³

2007

IJMMM

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The Subsurface Damage (SSD) in silicon wafers induced by any mechanical material-removal processes has to be removed by subsequent processes. Therefore, the measurement of SSD is critically important for cost-effective manufacturing of silicon wafers. This review paper presents several Non-Destructive Evaluation (NDE) methods for SSD in silicon wafers, including X-ray diffraction, micro-Raman spectroscopy, photoluminescence and laser scattering.

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Grinding-and-Slicing Technique as an Advanced Technology for Silicon Wafer Slicing

Cited by 26 publications

References 5 publications

Methods for Detection of Subsurface Damage: A Review

Methods for Detection of Subsurface Damage: A Review

Laser-assisted ultrathin die packaging: Insights from a process study

Non-destructive evaluation methods for subsurface damage in silicon wafers: a literature review

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