Gravure Printing of Conductive Inks on Glass Substrates for Applications in Printed Electronics

Hrehorova, Erika; Rebros, Marian; Pekarovičová, Alexandra; Bazuin, Bradley J.; Ranganathan, Adarsh; Garner, Sean; Merz, Gary; Tosch, John; Boudreau, R.

doi:10.1109/jdt.2010.2065214

Cited by 84 publications

(57 citation statements)

References 9 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The electrical properties of the printed lines annealed within the range of 90-120°C were similar, demonstrating that this process will be applicable to low-temperature processes. Although line resistances of 30-70 Ω mm −1 were higher than the values obtained using silver particle ink [28] (most likely due to the wire characteristics, the shallower pattern depth, and the greater material density), these line resistance values are expected to be sufficient for the use in printed electronics with high transmittances. Adhesion is an important metric for patterned conductors on flexible required to ensure device performance.…”

Section: Resultsmentioning

confidence: 71%

Patterned silver nanowires using the gravure printing process for flexible applications

2015

View full text Add to dashboard Cite

Section: Resultsmentioning

confidence: 71%

Patterned silver nanowires using the gravure printing process for flexible applications

2015

View full text Add to dashboard Cite

“…In addition to the interconnection of components to conventional circuits, Ag filled inks and ICAs have been used for the direct printing of electrically conductive tracks on substrates [5] to enable fully additive manufacture. However, the high cost of silver has restricted these uses to relatively high value applications in relatively low volume [3] .…”

Section: Introductionmentioning

confidence: 99%

Copper conductive adhesives for printed circuit interconnects

Litchfield

Hutt

et al. 2012

2012 IEEE 62nd Electronic Components and Technology Conference

View full text Add to dashboard Cite

Isotropically conductive adhesives (ICAs) and inks are seen as suitable candidates for interconnecting components and for printed circuits. Silver (Ag) filled ICAs and inks are the most popular due to their high conductivity and good reliability. However, the price of Ag is a significant issue for the wider exploitation of these materials in low cost, high volume applications such as printed electronics. Copper (Cu) is considered as a more cost-effective filler with greater abundance. However, one of the major barriers to the implementation of Cu loaded ICAs is the poor oxidation resistance of Cu particles. The copper oxide is non-conducting and hence, the conductivity of untreated Cu loaded ICAs is limited. In this work, an efficient method for the removal of the copper oxide from copper powders and application of a protective organic coating to prevent re-oxidation was developed. The coating was found to be able to limit the reoxidation of the copper before mixing and curing of the adhesive. The treated copper powder was combined with an adhesive resin and tracks were stencil printed onto glass substrates, and cured by heating under an inert atmosphere. The effect of different adhesive resins was investigated and the samples were characterised for electrical performance and microstructure. Tracks with electrical conductivity comparable to Ag filled adhesives were obtained. The cured materials showed good stability of resistivity during storage under ambient conditions, but when exposed to 85 o C and 85% relative humidity, the resistivity of exposed tracks increased substantially after 12 hours storage and methods to reduce this were identified. Functional circuits were fabricated by printing a pattern of Cu paste, placing surface mount components into the wet paste and curing. IntroductionOne of the most essential interconnection platforms of electronic products is the printed circuit board (PCB). Many materials and processing methods are currently used for PCB applications including organic (FR4), ceramic and polymer substrates. For many of these substrates one of the standard technologies for patterning metal conductors (typically copper) to form conducting lines between the electrical components is to use etching to selectively remove material from a continuous film of the metal that is laminated or deposited across the surface. This subtractive process requires accurate photolithography and etching steps in order to define the pattern from the blank metal film and the many process steps make the technology relatively slow and inflexible. In order to speed up processing, reduce waste and cost,

show abstract

“…Printed electronics device is fabricated by several printing methods including the screen printing, gravure printing, and ink-jet printing [5][6][7][8]. First, screen printing was widely used from long ago because it had simple printing tools which included stencil and squeegee.…”

Section: Introductionmentioning

confidence: 99%

Transmission line printed using silver nanoparticle ink on FR-4 and polyimide substrates

Sim

Lee

Kang

et al. 2016

Micro and Nano Syst Lett

View full text Add to dashboard Cite

In this paper, nano-silver ink-jet printed transmission lines were fabricated to investigate RF performance on both flame retardant (FR-4) and polyimide (PI) as rigid and flexible substrates. The transmission lines were printed by using the ink-jet printer with velocity of 3.5 mm/s and were sintered in a convection oven with 250 °C. The RF performance of transmission lines was simulated and measured at low frequencies. The transmission loss is measured to be 0.22 dB@1 GHz and 0.32 dB@1 GHz, respectively, for the FR-4 and PI substrates, respectively. The return loss has over 16 dB for FR-4 substrate and over 12 dB for PI substrate. The RF performance of transmission line was investigated and discussed in regard to an influence by two substrates. The measured RF performance of fabricated transmission lines results in the possibility that flexible device is explored in low frequencies application.

show abstract

Gravure Printing of Conductive Inks on Glass Substrates for Applications in Printed Electronics

Cited by 84 publications

References 9 publications

Patterned silver nanowires using the gravure printing process for flexible applications

Patterned silver nanowires using the gravure printing process for flexible applications

Copper conductive adhesives for printed circuit interconnects

Transmission line printed using silver nanoparticle ink on FR-4 and polyimide substrates

Contact Info

Product

Resources

About