Graphene nanocomposites as thermal interface materials for cooling energy devices

Dmitriev, A. S.; Valeev, Anvar

doi:10.1088/1742-6596/891/1/012359

Cited by 10 publications

(5 citation statements)

References 4 publications

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“…Most of prior works on graphene TIMs report the thermal conductivity values of the composites and, in some cases, temperature rise experiments with specific device structures [ 34 , 50 , 51 , 52 ]. The questions of the thermal contact resistance of graphene TIMs with the surfaces of interest and the effects of roughness on the TIM performance have not been properly addressed.…”

Section: Introductionmentioning

confidence: 99%

Noncured Graphene Thermal Interface Materials for High-Power Electronics: Minimizing the Thermal Contact Resistance

2021

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We report on experimental investigation of thermal contact resistance, RC, of the noncuring graphene thermal interface materials with the surfaces characterized by different degree of roughness, Sq. It is found that the thermal contact resistance depends on the graphene loading, ξ, non-monotonically, achieving its minimum at the loading fraction of ξ ~15 wt %. Decreasing the surface roughness by Sq~1 μm results in approximately the factor of ×2 decrease in the thermal contact resistance for this graphene loading. The obtained dependences of the thermal conductivity, KTIM, thermal contact resistance, RC, and the total thermal resistance of the thermal interface material layer on ξ and Sq can be utilized for optimization of the loading fraction of graphene for specific materials and roughness of the connecting surfaces. Our results are important for the thermal management of high-power-density electronics implemented with diamond and other wide-band-gap semiconductors.

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Section: Introductionmentioning

confidence: 99%

Noncured Graphene Thermal Interface Materials for High-Power Electronics: Minimizing the Thermal Contact Resistance

2021

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“…The unique heat conduction properties of graphene, discovered a decade ago [13][14][15][16], stimulated investigations into graphene's potential as a filler material in cured and non-cured TIMs [8,[17][18][19][20][21] and solid thermal coatings [22][23][24]. Initial studies were limited to small loading fractions, f<10 vol.…”

Section: Introductionmentioning

confidence: 99%

Thermal and electrical conductivity control in hybrid composites with graphene and boron nitride fillers

Lewis

Barani

Magana

et al. 2019

Mater. Res. Express

111

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We report on the thermal and electrical properties of hybrid epoxy composites with graphene and boron nitride fillers. The thicknesses, lateral dimensions, and aspect ratios of each filler material were intentionally selected for geometric similarity to one another, in contrast to prior studies that utilized dissimilar filler geometries to achieve a "synergistic" effect. We demonstrate that the electrically-conductive graphene and electrically-insulating boron nitride fillers allow one to effectively engineer the thermal and electrical conductivities of their resulting composites. By varying the constituent fraction of boron nitride to graphene in a composite with ~44% total filler loading, one can tune the thermal conductivity enhancement from a factor of ×15 to ×35 and increase the electrical conductivity by many orders of magnitude. The obtained results are important for the development of next-generation thermal interface materials with controllable electrical properties necessary for applications requiring either electrical grounding or insulation.

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“…Due to the exceptional thermal conductivity of graphene, found to be well above 2000 Wm −1 K −1 , and its potential to be a cheap, mass-producible material, it has seen extensive study as a potential filler material for next-generation polymeric TIMs [29][30][31][32][33][34][35][36][37][38]. Few-layer graphene retains very high thermal conductivity while offering a larger cross-sectional area, useful for both heat transfer and robustness upon contact with the matrix material.…”

Section: Introductionmentioning

confidence: 99%

Power Cycling and Reliability Testing of Epoxy-Based Graphene Thermal Interface Materials

Lewis

Perrier

Mohammadzadeh

et al. 2020

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We report on the lifespan evolution of thermal diffusivity and thermal conductivity in curing epoxy-based thermal interface materials with graphene fillers. The performance and reliability of graphene composites have been investigated in up to 500 power cycling measurements. The tested composites were prepared with an epoxy resin base and randomly oriented fillers consisting of a mixture of few-layer and single-layer graphene. The power cycling treatment procedure was conducted with a custom-built setup, while the thermal characteristics were determined using the “laser flash” method. The thermal conductivity and thermal diffusivity of these composites do not degrade but instead improve with power cycling. Among all tested filled samples with different graphene loading fractions, an enhancement in the thermal conductivity values of 15% to 25% has been observed. The obtained results suggest that epoxy-based thermal interface materials with graphene fillers undergo an interesting and little-studied intrinsic performance enhancement, which can have important implications for the development of next-generation thermal interface materials.

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Graphene nanocomposites as thermal interface materials for cooling energy devices

Cited by 10 publications

References 4 publications

Noncured Graphene Thermal Interface Materials for High-Power Electronics: Minimizing the Thermal Contact Resistance

Noncured Graphene Thermal Interface Materials for High-Power Electronics: Minimizing the Thermal Contact Resistance

Thermal and electrical conductivity control in hybrid composites with graphene and boron nitride fillers

Power Cycling and Reliability Testing of Epoxy-Based Graphene Thermal Interface Materials

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