Graphene induced carbonization of polyimide films to prepared flexible carbon films with improving-thermal conductivity

Ma, Lianru; Wang, Yanxiang; Wang, Yaoyao; Wang, Chengguo; Gao, Xueping

doi:10.1016/j.ceramint.2019.10.042

Cited by 30 publications

(25 citation statements)

References 31 publications

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“…Figure 2(f) shows the Raman spectra of GNPs, GO, NH 2 -GO, and NH 2 -rGO. GNPs, GO, NH 2 -GO, and NH 2 -rGO all have strong Raman D and G peaks at 1341 cm -1 and 1580 cm -1 , which are related to the random vibration of amorphous carbon (sp 3 hybridized carbon) and in-plane vibration of graphitic carbon (sp 2 hybridized carbon) [42]. The intensity ratio of D and G peak (I D /I G ) is used to characterize the defect density [43].…”

Section: Resultsmentioning

confidence: 99%

Significant Reduction of Interfacial Thermal Resistance and Phonon Scattering in Graphene/Polyimide Thermally Conductive Composite Films for Thermal Management

et al. 2021

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The developing flexible electronic equipment are greatly affected by the rapid accumulation of heat, which is urgent to be solved by thermally conductive polymer composite films. However, the interfacial thermal resistance (ITR) and the phonon scattering at the interfaces are the main bottlenecks limiting the rapid and efficient improvement of thermal conductivity coefficients (λ) of the polymer composite films. Moreover, few researches were focused on characterizing ITR and phonon scattering in thermally conductive polymer composite films. In this paper, graphene oxide (GO) was aminated (NH2-GO) and reduced (NH2-rGO), then NH2-rGO/polyimide (NH2-rGO/PI) thermally conductive composite films were fabricated. Raman spectroscopy was utilized to innovatively characterize phonon scattering and ITR at the interfaces in NH2-rGO/PI thermally conductive composite films, revealing the interfacial thermal conduction mechanism, proving that the amination optimized the interfaces between NH2-rGO and PI, reduced phonon scattering and ITR, and ultimately improved the interfacial thermal conduction. The in-plane λ (λ∥) and through-plane λ (λ⊥) of 15 wt% NH2-rGO/PI thermally conductive composite films at room temperature were, respectively, 7.13 W/mK and 0.74 W/mK, 8.2 times λ∥ (0.87 W/mK) and 3.5 times λ⊥ (0.21 W/mK) of pure PI film, also significantly higher than λ∥ (5.50 W/mK) and λ⊥ (0.62 W/mK) of 15 wt% rGO/PI thermally conductive composite films. Calculation based on the effective medium theory model proved that ITR was reduced via the amination of rGO. Infrared thermal imaging and finite element simulation showed that NH2-rGO/PI thermally conductive composite films obtained excellent heat dissipation and efficient thermal management capabilities on the light-emitting diodes bulbs, 5G high-power chips, and other electronic equipment, which are easy to generate heat severely.

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Section: Resultsmentioning

confidence: 99%

Significant Reduction of Interfacial Thermal Resistance and Phonon Scattering in Graphene/Polyimide Thermally Conductive Composite Films for Thermal Management

et al. 2021

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“…Moreover, natural graphite (NG) films (100–700 W (mK) −1 ) and graphitized polyimide (GPI) films (1000 [ 103 ] and 1750 W (mK) −1 [ 2 ]) with ultrahigh k have been produced from expanding graphite via compressing and graphitization of PI films at high temperatures, respectively [ 108 ]. Some polymers with high carbon yield as precursors can also be transformed into graphite structure after carbonization, a telling example is PI with dianhydride and diamine structures [ 101 , 108 ]. Under high temperature, the elements of N, H and O can escape in the form of gas from PI films [ 108 ].…”

Section: High-performance Thermally Conductive Filmsmentioning

confidence: 99%

Emerging Flexible Thermally Conductive Films: Mechanism, Fabrication, Application

et al. 2022

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Effective thermal management is quite urgent for electronics owing to their ever-growing integration degree, operation frequency and power density, and the main strategy of thermal management is to remove excess energy from electronics to outside by thermal conductive materials. Compared to the conventional thermal management materials, flexible thermally conductive films with high in-plane thermal conductivity, as emerging candidates, have aroused greater interest in the last decade, which show great potential in thermal management applications of next-generation devices. However, a comprehensive review of flexible thermally conductive films is rarely reported. Thus, we review recent advances of both intrinsic polymer films and polymer-based composite films with ultrahigh in-plane thermal conductivity, with deep understandings of heat transfer mechanism, processing methods to enhance thermal conductivity, optimization strategies to reduce interface thermal resistance and their potential applications. Lastly, challenges and opportunities for the future development of flexible thermally conductive films are also discussed.

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“…It is difficult to achieve high thermal conductivity and ideal mechanical properties for the graphite films (e.g., internally contradictory indices like high modulus (associating with thermal conductivity) and high flexibility are hardly satisfied simultaneously) except a few reports such as Refs [2,11,39,40]. Nowadays, the modification by doping of PI precursor with graphene (and graphene oxide) and other precursors (e.g., polyacrylonitrile) is a good strategy to improve the flexibility of graphite films with high thermal conductivity [38,[41][42][43] as shown in Figure 17b. It is interesting to note that various striking cranes with good flexibility as shown in Figure 18 made with different raw materials by different methods and processes have been successfully prepared [2,19,38,43].…”

Section: Latest Developments Of Pi-derived Carbons With High Thermal Conductivity 61 Modification Of Pi Precursor To Improve the Flexibilmentioning

confidence: 99%

Polyimide-Derived Graphite Films with High Thermal Conductivity

Yuan¹,

Cui²

2022

Polyimides

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Nowadays, polyimide-derived graphite films with high thermal conductivity have been increasingly applied in many cutting-edge fields needing thermal management, such as highly integrated microelectronics and wireless communication technologies. This chapter first introduces a variety of functional graphite films with high thermal conductivity of 500–2000 W/m K in the planar direction, then provides the preparation technology (including lab-scale preparation and industrial production) and quality control strategy of high-thermal-conductivity graphite films, which are derived from a special polymer- polyimide (PI) by carbonization and graphitization treatments through a suitable molding press in a vacuum furnace. The morphology, microstructure and physical properties as well as the microstructural evolution and transformation mechanism of PI films during the whole process of high-temperature treatment are comprehensively introduced. The nature of PI precursor (e.g., the molecular structure and planar molecular orientation) and preparation technics (e.g., heat-treatment temperature and molding pressure) are critical factors influencing their final physical properties. Currently challenged by the emerging of graphene-based graphite films, the latest developments and future prospects of various PI-derived carbons and composites (beyond films) with high thermal conductivity have been summarized at the end. This chapter may shed light on a promising and versatile utilization of PI-derived functional carbon materials for advanced thermal management.

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Graphene induced carbonization of polyimide films to prepared flexible carbon films with improving-thermal conductivity

Cited by 30 publications

References 31 publications

Significant Reduction of Interfacial Thermal Resistance and Phonon Scattering in Graphene/Polyimide Thermally Conductive Composite Films for Thermal Management

Significant Reduction of Interfacial Thermal Resistance and Phonon Scattering in Graphene/Polyimide Thermally Conductive Composite Films for Thermal Management

Emerging Flexible Thermally Conductive Films: Mechanism, Fabrication, Application

Polyimide-Derived Graphite Films with High Thermal Conductivity

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