2013
DOI: 10.7567/jjap.52.110122
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Graphene Growth and Carbon Diffusion Process during Vacuum Heating on Cu(111)/Al2O3Substrates

Abstract: In this study, the behavior of carbon atoms in the annealing/cooling process of graphene/Cu(111) substrates is investigated using photoelectron spectroscopy and secondary ion mass spectroscopy. After the growth of graphene on Cu(111) surfaces, Cu2O was formed at the graphene/Cu interface during transportation through air atmosphere. The Cu2O layer completely disappeared by vacuum annealing at 500 °C. Graphene was decomposed and carbon atoms diffused into the Cu substrate by further elevation of annealing tempe… Show more

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Cited by 20 publications
(13 citation statements)
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“…This means that the surface quality deteriorates when heating above 650 K. Recently it has been reported that Cu 2 O is formed at the graphene/Cu(111) interface during exposure to ambient conditions, and that it disappears when heating above ca. 650 K [27]. This is consistent with our observation of a pressure increase when heating the sample at 650 K, which might be due to oxygen desorption.…”
Section: Resultssupporting
confidence: 92%
“…This means that the surface quality deteriorates when heating above 650 K. Recently it has been reported that Cu 2 O is formed at the graphene/Cu(111) interface during exposure to ambient conditions, and that it disappears when heating above ca. 650 K [27]. This is consistent with our observation of a pressure increase when heating the sample at 650 K, which might be due to oxygen desorption.…”
Section: Resultssupporting
confidence: 92%
“…34 and pp* (satellite peak/electrons transition) bonding respectively. [35][36][37] In Fig. 2(f), all tted peaks reveal the sp 2 hybridization property of GF, traces of oxygen content present in GF and the p-p* electrons transition which enhances the carbon to carbon bonds in graphene and conrms the high quality of GF.…”
Section: Electrochemical Characterizationmentioning
confidence: 99%
“…It is noted that graphene can protect the surface of Cu substrate from oxidation in a short term due to its impermeability and thermal/chemical stability4546. However, the Cu oxidation can still occur4748 because the carbon-metal interaction can accelerate electrochemical oxidation of Cu substrate through galvanic corrosion4649.…”
Section: Discussionmentioning
confidence: 99%