“…Hexagonal boron nitride ( h -BN) has attracted great attention due to its 2D layered hexagonal honeycomb structure and excellent properties, such as outstanding chemical and thermal stability and mechanical strength, good electric insulation, and ultrahigh thermal conductivity, making it a promising functional filler candidate for polymer-based thermal management materials. − Furthermore, some studies have revealed that BN can improve EWA ability to some extent. , On one hand, BN can effectively enhance the impedance matching and improve the EWA performance by adjusting the dielectric properties of materials. On the other hand, as a 2D material, BN in the EWA composites, with an increased number of interface, induces dipole polarization and interface polarization, thereby enhancing EWA performances. − Inspired by these insights, a reasonable combination of BN and CNTs may not only improve the EWA ability but also effectively constructs a heat flux pathway, enabling EWA materials to simultaneously have high thermal conductivity . Meanwhile, many reported research studies characterize EWA ability and thermal conductivity properties on different substrates with varying filler loading, which cannot truly reflect the integrated EWA ability and thermal conductivity in one material.…”