Graphene-Based Hybrid Composites for Efficient Thermal Management of Electronic Devices

Shtein, Michael; Nadiv, Roey; Buzaglo, Matat; Regev, Oren

doi:10.1021/acsami.5b07866

Cited by 152 publications

(116 citation statements)

References 40 publications

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“…In other words, at f g = 15 wt% and f Cu = 40 wt%, all possible percolation paths of highly conductive fillers including graphene–graphene, graphene–Cu‐NP, and Cu‐NP–Cu‐NP have been formed. These results confirm the existence of an optimum loading fraction for each filler in composites with the binary dissimilar fillers, which has been reported in some studies for other types of fillers . The saturation after an abrupt change demonstrates that the heat transport is dominated by graphene–graphene fillers, and at approximately f Cu = 40 wt% the entire percolated graphene–graphene network of conductive paths has been formed.…”

Section: Resultssupporting

confidence: 89%

“…However, a certain range in the size distribution of FLG fillers turned out to be even beneficial. The size distribution of the fillers can result in the “synergistic” effect, characteristic for the fillers of different dimensions . The “synergistic” effects constitutes a stronger enhancement of the thermal conductivity of the composites with the size‐dissimilar binary fillers than with the individual fillers of the same total concentration .…”

Section: Introductionmentioning

confidence: 99%

“…[10] The results have been independently confirmed and improved by other research groups, which obtained similar enhancement factors at lower graphene concentrations. [29][30][31] The first graphene-based composites have been prepared using raw graphite as the source material to produce SLG and FLG fillers via liquid phase exfoliation (LPE). The preparation method includes chemical processing, sonication, and centrifugation.…”

Section: Introductionmentioning

confidence: 99%

“…[31][32][33][34][35][36][37][38][39][40][41] The "synergistic" effects constitutes a stronger enhancement of the thermal conductivity of the composites with the size-dissimilar binary fillers than with the individual fillers of the same total concentration. [31][32][33][34][35][36][37][38][39][40][41] Recent technological advancements made it possible to produce FLG fillers of different sizes and thicknesses using LPE [42,43] or graphene oxide reduction methods. [44][45][46][47][48] These developments open up a possibility of industrial production of composites with the high loading of graphene.…”

Section: Introductionmentioning

confidence: 99%

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Thermal Properties of the Binary‐Filler Hybrid Composites with Graphene and Copper Nanoparticles

Barani

Mohammadzadeh

Geremew

et al. 2019

Adv Funct Materials

203

160

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The thermal properties of epoxy‐based binary composites comprised of graphene and copper nanoparticles are reported. It is found that the “synergistic” filler effect, revealed as a strong enhancement of the thermal conductivity of composites with the size‐dissimilar fillers, has a well‐defined filler loading threshold. The thermal conductivity of composites with a moderate graphene concentration of fg = 15 wt% exhibits an abrupt increase as the loading of copper nanoparticles approaches fCu ≈ 40 wt%, followed by saturation. The effect is attributed to intercalation of spherical copper nanoparticles between the large graphene flakes, resulting in formation of the highly thermally conductive percolation network. In contrast, in composites with a high graphene concentration, fg = 40 wt%, the thermal conductivity increases linearly with addition of copper nanoparticles. A thermal conductivity of 13.5 ± 1.6 Wm−1K−1 is achieved in composites with binary fillers of fg = 40 wt% and fCu = 35 wt%. It has also been demonstrated that the thermal percolation can occur prior to electrical percolation even in composites with electrically conductive fillers. The obtained results shed light on the interaction between graphene fillers and copper nanoparticles in the composites and demonstrate potential of such hybrid epoxy composites for practical applications in thermal interface materials and adhesives.

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Section: Resultssupporting

confidence: 89%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Thermal Properties of the Binary‐Filler Hybrid Composites with Graphene and Copper Nanoparticles

Barani

Mohammadzadeh

Geremew

et al. 2019

Adv Funct Materials

203

160

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“…The reported values of the "intrinsic" thermal conductivity of highquality large graphene layers are in the range from 2000 to 5000 W m −1 K −1 near room temperature (RT). [77,78] One of the conclusions from the reports of the thermal properties of composites with graphene and FLG is that there exists an optimum range of the filler lateral dimensions, thicknesses, and aspect ratios for heat conduction. [64,[67][68][69] Numerous studies reported enhancement of the thermal properties of TIMs and various other composites as a result of incorporation of SLG and FLG.…”

Section: Introductionmentioning

confidence: 99%

Dual‐Functional Graphene Composites for Electromagnetic Shielding and Thermal Management

Kargar

Barani

Balinskiy

et al. 2018

Adv Elect Materials

192

132

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and environment. [12][13][14] The current industrial and safety standards require blocking of more than 99% of the EM radiation from any electronic devices. [1,[15][16][17] From the other side, the operation of the electronic devices can be disrupted by the outside EM waves. The heat and EM radiation have an inherent connection-absorption of EM waves by any material results in its heating. The energy from EM wave transfers to electrons and then to phonons-quanta of crystal lattice vibrations. The conventional approach for handling the heat and EM radiation problems is based on utilization of the thermal interface materials (TIM), which can spread the heat, and electromagnetic interference (EMI) shielding materials, which can protect from EM waves. These two types of materials have different, and, often, opposite characteristics, e.g., excellent EMI material can be a poor heat conductor, while efficient TIM can utilize electrically nonconductive fillers, resulting in its transparency for EM waves. Here, we propose a concept of the "dual-functional" EMI shielding-TIM materials, and demonstrate it on the example of graphene composites.It is well known that EMI shielding requires interaction of the EM waves with the charge carriers inside the material so that EM radiation is reflected or absorbed. For this reason, the EMI shielding material must be electrically conductive or contain electrically conductive fillers, although a high electrical conductivity is not required. The bulk electrical resistivity on the order of 1 Ω cm is sufficient for most of EMI shielding applications. [1,3,15] Most of the polymer-based materials widely used as TIMs in electronic packaging are electrically insulating and, therefore, transmit EM waves. Conventionally, metal particles are added as fillers in high volume fractions to the base polymer matrix in order to increase the electrical conductivity and prevent EM wave propagation from the device to the environment and vice versa. [1,[18][19][20][21] However, the polymer-metal composites suffer from high weight, cost, and corrosion, which make them an undesirable choice for the state-of-the-art downscaled electronics. Several studies reported the use of carbon fibers, [22][23][24][25][26][27][28][29] carbon black, [30,31] bulk graphite, [32][33][34] carbon nanotubes (CNT), [16,17,[35][36][37][38][39] reduced graphene oxide (rGO), [2,6,[40][41][42][43][44][45][46][47][48][49][50] graphene, [51][52][53][54] and combination of carbon allotropes with orThe synthesis and characterization of epoxy-based composites with few-layer graphene fillers, which are capable of dual-functional applications, are reported. It is found that composites with certain types of few-layer graphene fillers reveal an efficient total electromagnetic interference shielding, SE tot ≈ 45 dB, in the important X-band frequency range, f = 8.2 −12.4 GHz, while simultaneously providing high thermal conductivity, K ≈ 8 W m −1 K −1 , which is a factor of ×35 larger than that of the base matrix material. The efficiency of the d...

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High Performance Hybrid Filler Reinforced Epoxy Nanocomposites

Chhetri

Kuila

Srivastava

2017

Hybrid Nanomaterials

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Graphene-Based Hybrid Composites for Efficient Thermal Management of Electronic Devices

Cited by 152 publications

References 40 publications

Thermal Properties of the Binary‐Filler Hybrid Composites with Graphene and Copper Nanoparticles

Thermal Properties of the Binary‐Filler Hybrid Composites with Graphene and Copper Nanoparticles

Dual‐Functional Graphene Composites for Electromagnetic Shielding and Thermal Management

High Performance Hybrid Filler Reinforced Epoxy Nanocomposites

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