Grain size effect on springback behavior in bending of Ti-2.5Al-1.5Mn foils

Ma, Zhenwu; Guo-quan, Tong; Chen, Feng; Wang, Qi; Wang, Shichuan

doi:10.1016/j.jmatprotec.2015.04.025

Cited by 29 publications

(12 citation statements)

References 17 publications

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“…Rolling forming is a promising process for manufacturing surface microstructure sheets because of its low forming force, high efficiency, low cost, and good forming accuracy [7]. Ma et al [8] found that the grain size and the crystal texture had a significant effect on the springback by rolling forming. Huang et al [9] observed that the maximum thickness thinning of the micro channels with aspect ratios up to 1.0 was 18.7% by the micro-channel rolling forming test.…”

Section: Introductionmentioning

confidence: 99%

Investigation of Electrically-Assisted Rolling Process of Corrugated Surface Microstructure with T2 Copper Foil

et al. 2019

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Electrically-assisted (EA) forming is a low-cost and high-efficiency method to enhance the formability of materials. In the study, EAF tensile tests are carried out to study the properties of T2 copper foil in an annealed state, and the effect of the electric current on the forming quality of corrugated foils is further studied in the EA rolling forming process. The result shows that the current reduces the flow stress and the fracture strain, which is different from the result of rolled samples. The joule heating effect on mechanical properties is significant in EA tension, and the softening effect of the surface layer can be observed at tensile strength, due to the grain size effect. Moreover, the current can weaken the grain size effect. In the rolling forming process, the influence of different electrical parameters on the forming height is remarkable, especially for the rolled T2 copper. The appropriate electrical parameters can improve the forming height, while keeping a small thickness thinning. Nevertheless, the high current density will lead to local rupture. This study proves that the current can improve the forming quality of the corrugated foils and is a promising surface texture forming process.

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Section: Introductionmentioning

confidence: 99%

Investigation of Electrically-Assisted Rolling Process of Corrugated Surface Microstructure with T2 Copper Foil

et al. 2019

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“…Liu et al [4] found that a large springback occurs with thickness decreasing or grain size increasing. Besides, an increasing of elastic anisotropy of surface grains with the reduction of grains along the thickness direction will cause the springback angle scattering [4,5]. Chen et al [6] discovered that yield strength and maximum punch force decrease with a decrease of t/d ratio.…”

Section: Introductionmentioning

confidence: 99%

“…Zhen-Yuan [12] decreased the bending moment in bending area with a coining process so that and springback angle would be decreased. Besides, Ma et.al [5] stated that in a roll bending test, the springback angle, and its scattering can be reduced by controlling the sizing repetitions, sizing force, holding time and punch speed. Furthermore, Zheng et al [13] investigated an elevated temperature bending process with thin pure titanium foils.…”

Section: Introductionmentioning

confidence: 99%

Preliminary Investigation of Micro-V-Bending

2017

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Abstract. Bending in sheet metal forming is defined as uniformly straining process around a linear axis. A V-bending process is normally used in sheet metal working due to the tool and process simplicity. The main problem in bending process is a springback occurrence which causes an error in part dimension. In a micro level, the springback angle is difficult to be assessed because of the influence of size effects in all aspects of the system. The springback behavior has been investigated in many previous kinds of research. However, the springback correction is still needed to be studied extensively so that it can be implemented reliably in micro-bending. The purpose of this research is to investigate the influence of punch velocity and holding time to the springback angle. The process is performed to the 0.1 mm thickness of copper foil. The punch velocities are 0.1 mm/s, 1 mm/s, and 10 mm/s. While the variation of holding time, which is set during the bottoming stage, are 7 s, 9 s, and 11 s. The result shows that the punch velocity clearly influences the springback angle. In addition, the holding time during the bottoming stage is a potential factor in springback angle correction.

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“…Diehl et al [18] performed free bending test to find that the scatter of springback angles in coarse-grained material was greater than that in the fine-grained one. [9]Recently, increasing numbers of research are focusing on the grain structure [19] and grains' stress-strain state [20,21] to explain the correlation between the grain size effect and springback.…”

Section: Introductionmentioning

confidence: 99%

Effect of Grain Size on Springback and System Energy in Micro V-Bending with Phosphor Bronze Foil

Fang

Jiang

Wang

et al. 2015

Metall Mater Trans A

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In this paper, the effect of grain size on springback in the micro V-bending process of phosphor bronze foil (face-centered cubic structure) is investigated. Grain size effect is expressed by the ratio of material thickness (T) to average grain size (D), and these T/D values are divided into three groups: larger than 1, less than 1, and approximately equal to 1. It has been found that springback angles were the lowest when T/D ≈ 1. Electron backscattering diffraction (EBSD) measurement results show that the twinning boundaries change with the ratios of T/D before and after bending. When T/D > 1, the high relative frequency of Σ3 implies that the specimen has a high system energy, which can result in large springback behavior. The equal relative frequencies of Σ3 for specimens with three ratios also prove that twinning boundaries can be regarded as an indicator of system energy. The effect of grain size on grain reorientation during bending is also discussed, and it was found that the least quantities of high surface energy {110} planes in the T/D ≈ 1 material could contribute to the least springback angles. the high relative frequency of Σ3 implies that the system specimen has a high system energy, which can result in large springback behaviour. The equal relative frequencies of Σ3 after bending for three ratios' specimens also prove that twinning boundaries can be regarded as an indicator of system energy. Moreover, the effect of grain size on grain reorientation during bending was discussed, and the least quantities of high surface energy {110} planes in the T/D≈1 material could contribute to the least springback angles.

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Grain size effect on springback behavior in bending of Ti-2.5Al-1.5Mn foils

Cited by 29 publications

References 17 publications

Investigation of Electrically-Assisted Rolling Process of Corrugated Surface Microstructure with T2 Copper Foil

Investigation of Electrically-Assisted Rolling Process of Corrugated Surface Microstructure with T2 Copper Foil

Preliminary Investigation of Micro-V-Bending

Effect of Grain Size on Springback and System Energy in Micro V-Bending with Phosphor Bronze Foil

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