Abstract:This paper investigated the effect of trace addition of Al and Mg on the grain refinements of Cu6Sn5in Sn-3wt%Ag-5wt%Cu high temperature solder alloys. Furthermore, the effect of Al and Mg addition on the Sn/Ag3Sn eutectic were also investigated. It was found that the addition of both Al and Mg successfully refined the Cu6Sn5in Sn-3wt%Ag-5wt%Cu solder alloy. In addition, Al suppresses the formation of Ag3Sn in the Sn/Ag3Sn eutectic; while Mg promotes the formation of fine Sn/Ag3Sn eutectic microstructure. The … Show more
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